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Semi-conductor high power luminous module having heat insulating effect

A light-emitting module and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as unfavorable heat dissipation

Inactive Publication Date: 2008-04-16
ENRAYTEK OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the headlights are directly replaced with high-power LED devices currently on the market, at least a part of the heat sink will be placed in the car body, which will make it bear the high heat of the engine and other devices, which is not conducive to heat dissipation

Method used

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  • Semi-conductor high power luminous module having heat insulating effect
  • Semi-conductor high power luminous module having heat insulating effect
  • Semi-conductor high power luminous module having heat insulating effect

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specific Embodiment

[0051] In addition, according to another preferred specific embodiment, such as Figure 1C As shown, compared with the first preferred embodiment, the contact portion 124 of a semiconductor light-emitting module 1" can also be only partially immersed in a heat sink 11" and directly fixed on the heat sink 14' by a heat insulator 14'. on the cooling body 11". In addition, according to another preferred specific embodiment, such as Figure 1D As shown, compared with the first preferred embodiment, a heat insulator 14" of a semiconductor light emitting module 1"' can form a space with a gap with the radiator 11" to accommodate the contact portion 124. The contact portion 124 can still fix the contact portion 124 through the heat insulator 14" or fix it with another pressing plate (not shown in Fig. 1D). Finally, according to another preferred specific embodiment, as Figure 1E As shown, a semiconductor light-emitting module includes three diode light-emitting elements 13', which ...

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PUM

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Abstract

The present invention provides a semiconductor high-power lighting module which comprises a heating body, a heat conducting element and a diode lighting element. The heating body comprises a heat guard coupled on a first side of the heating body; the heating body is provided with a second side corresponding to the first side. The heat guard is provided with a third side corresponding to the first side. The environmental temperature of the third side is higher than that of the second side. The heat conducting element is provided with a flat end and a contact part which is tightly jointed with the heating body. The diode lighting element is arranged on the flat end of the heat conducting element. The semiconductor lighting module of the invention is applied to vehicle headlights and is characterized by electricity-saving performance and long life-span; the heating body even can be integrated with the vehicle shell to be both attractive and practical.

Description

technical field [0001] The invention relates to a semiconductor light-emitting module (Semiconductor light-emitting module), in particular to a semiconductor high-power light-emitting module with high heat dissipation efficiency. Background technique [0002] Light-emitting diodes (LEDs) have many advantages such as power saving, shock resistance, fast response, and suitability for mass production. Therefore, at present, the lighting equipment using light-emitting diodes as light sources continues to be researched and developed. However, high-power light-emitting diodes also generate high heat, so the heat dissipation problem has become the mainstream in this field. A general heat dissipation method is to place a radiator (which may include several fins) in a relatively low temperature environment to dissipate heat. However, in many practical applications, the heat sink is placed in the relatively high temperature environment, resulting in a high junction temperature of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L23/367
CPCH01L2924/0002H01L2224/48137H01L2224/48091H01L2924/00014
Inventor 陈振贤
Owner ENRAYTEK OPTOELECTRONICS
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