Apparatus and method for fabricating microphone assembly

Abstract

A microphone assembly is provided. An apparatus for fabricating the microphone assembly includes a lower mold attached to a bottom surface of a printed circuit board (PCB) on which a microphone chip is mounted, an upper mold installed on the PCB and including receiving spaces receiving the microphone chips and an inlet for injecting a material ; and a material injector movably installed with respect to the inlet to inject epoxy or silicon into the receiving spaces of the upper mold. A method for fabricating the microphone phone includes mounting microphone chips, installing the mold, injecting the material, and cutting the PCB and producing the microphone assembly. The microphone assembly is fabricated in a transfer molding process or an injection molding process using a mold to reduce the processing time required for fabricating the microphone and fabricate high quality microphone due to improvement of the workability and productivity. In addition, the required backchamber is obtained by changing the shape of the microphone to allow the microphone to change the sensitivity.

Description

technical field [0001] The present invention relates to a microphone assembly constituting a microphone, and more particularly to a microphone assembly manufacturing device and a manufacturing method thereof, which can shorten the manufacturing time of the microphone by utilizing transfer molding or injection molding using a mold to manufacture the microphone assembly. The process takes time and enables the manufacture of high-quality microphones. Background technique [0002] Generally, microphone assemblies for constituting electret condenser microphones (ELECTRET CONDENSER MICROPHONE) and digital microphones (DIGITAL MICROPHONE) are manufactured by cutting one by one after mounting a plurality of microphone chips on a PCB. [0003] That is, if figure 1 and figure 2 As shown, the above-mentioned microphone assembly is mounted with a plurality of microphone chips (200) at a certain interval and in a uniform arrangement state above the PCB (100) having a certain width. ...

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Problems solved by technology

[0007] However, in the existing microphone assembly, it is difficult to adjust the shape and height of the molding according to the characteristics of the silicone resin or epoxy resin (E) injected during the above-mentioned manufacturing process, so it is difficult to produce uniform products. (E), it is difficult to realize microphone assemblies of various shapes

[0008] In addition, in the molding process of the existing microphone assembly, its dimensional accuracy is reduced, so it is difficult to ensure the back chamber (BACK-CHAMBER) of the microphone, which not only leads to a decline in the quality of the microphone, but also makes it difficult to change the sensitivity. The process of molding the above-mentioned microphone chip is cumbersome, so the process takes too much time and there are problems such as a decrease in productivity

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