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Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus

A radiator and laser technology, applied in the field of radiators, can solve the problems of high manufacturing cost, expensive materials and high thermal conductivity

Inactive Publication Date: 2008-04-16
HAMAMATSU PHOTONICS KK
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This is because if the laser diode and the heat sink thermally expand and contract due to the heat generated during the driving of the laser diode and the temperature change caused by the repeated switching of the laser diode, then there will be a difference in the thermal expansion rate of the laser diode due to the difference between the two. stress strain, the characteristics of the laser diode deteriorate
However, since materials with high thermal conductivity and the same degree of thermal expansion as laser diodes are expensive, if such materials are used to form the entire heat sink, the manufacturing cost will be high

Method used

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  • Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus
  • Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus
  • Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus

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Embodiment Construction

[0022] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in the description of the drawings, the same elements are denoted by the same symbols, and overlapping descriptions are omitted.

[0023] FIG. 1 is a perspective view showing the configuration of an embodiment of a laser stacking device according to the present invention. The laser stacking device 1 includes: three laser arrays 2a-2c, two copper plates 3a and 3b, two guide plates 4a and 4b, a supply pipe 5, a discharge pipe 6, four insulating members 7a-7d, and three Radiators 10a to 10c.

[0024] Next, each component will be described. Moreover, for the convenience of description, the positive direction of the Z-axis in FIG. 1 is taken as up, and the negative direction of the Z-axis is taken as down.

[0025] FIG. 2 is a perspective view showing the laser array 2a. The laser arrays 2b and 2c have the same structure as the laser array 2a. Each ...

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Abstract

A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion.

Description

technical field [0001] The present invention relates to a heat sink for cooling a heating body of a semiconductor device, a semiconductor laser device using the same, and a semiconductor laser stack device. Background technique [0002] In recent years, in order to efficiently cool high-output laser diodes, water-cooled heat sinks are often used. In order to improve cooling efficiency, it is preferable that the heat sink is made of a material with high thermal conductivity. Furthermore, it is preferable that the material of the heat sink has a thermal expansion coefficient close to that of the laser diode. This is because if the laser diode and the heat sink thermally expand and contract due to the heat generated during the driving of the laser diode and the temperature change caused by the repeated switching of the laser diode, then there will be a difference in the thermal expansion rate of the laser diode due to the difference between the two. Stress strain, the charact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36
CPCH01L23/473H01S5/4018H01S5/02264H01S5/02423H01S5/4025H01L2924/0002H01S5/02365H01L2924/00
Inventor 宫岛博文菅博文渡边信雄大石谕铃木伸孝
Owner HAMAMATSU PHOTONICS KK
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