Adhesive sheet for water jet laser dicing

A technology of laser cutting and adhesive sheet, which is applied in the direction of laser welding equipment, film/sheet adhesive, welding/welding/cutting items, etc. It can solve the problem of chip peeling, prevent peeling and improve adhesion , good permeability effect

Inactive Publication Date: 2008-05-14
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, in the cutting method using this laser technology, there is a problem that chips and the like are easily peeled off from the adhesive sheet fixing them due to the use of water flow. In this regard, an adhesive sheet suitable for water jet laser cutting has been proposed ( For example, Patent Document 2)

Method used

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  • Adhesive sheet for water jet laser dicing

Examples

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preparation example Construction

[0045] The acrylic polymer can be produced by, for example, polymerizing one or two or more monomers or a mixture thereof using known methods such as solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization. Among them, the solution polymerization method is preferable. Examples of the solvent used here include polar solvents such as ethyl acetate and toluene. The solution concentration is usually about 20 to 80% by weight.

[0046] In the preparation of polymers, polymerization initiators can be used. Examples of the polymerization initiator include peroxides such as hydrogen peroxide, benzoyl peroxide, and t-butyl peroxide. It is preferably used alone, but it can also be used in combination with a reducing agent as a redox type polymerization initiator. Examples of the reducing agent include ionized salts such as sulfites, bisulfites, iron, copper, and cobalt salts, amines such as triethanolamine, and reducing sugars such as aldo...

Embodiment

[0056] Examples of the pressure-sensitive adhesive sheet for water jet laser cutting of the present invention will be described in detail below.

[0057] (formation of adhesive layer)

[0058] In ethyl acetate, 60 parts by weight of methyl acrylate, 35 parts by weight of 2-ethylhexyl acrylate, and 5 parts by weight of acrylic acid were copolymerized by a conventional method. Thus, a solution containing an acrylic copolymer having a weight average molecular weight of 700,000 was obtained.

[0059]Next, to the solution containing the acrylic copolymer, 100 parts by weight of an ultraviolet curable oligomer (viscosity at 25°C: 10 Pa·sec) obtained by reacting pentaerythritol triacrylate and diisocyanate, 3 parts by weight A photopolymerization initiator (trade name "イルガキユア 651", manufactured by Chiba Speciaru Tei One Chemical Co., Ltd.) and 2 parts by weight of a polyisocyanate compound (trade name "Coroneto L", manufactured by Nippon Polyurethane Co., Ltd.) to obtain an acrylic ...

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Abstract

The invention provides an adhesive sheet. The invention ensures a better permeability and stably to liquids originating in the liquid stream during water jet laser dicing and allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in chips and IC components, and so on. The adhesive sheet for water jet laser dicing is characterized in that an adhesive layer is coated on a base film; and the base film comprises a net object which is made of fibers.

Description

technical field [0001] The present invention relates to an adhesive sheet for water-jet laser cutting (ウオタタ-エツツトトイシング), and more specifically, to a water-jet laser for cutting semiconductor wafers and / or semiconductor-related materials to be used for fixing. Adhesive sheets for water laser cutting. Background technique [0002] Conventionally, semiconductor wafers, semiconductor-related materials, etc. have been diced and separated into chips and IC parts by using a rotary blade. In this dicing step, generally, a semiconductor wafer is bonded to an adhesive sheet to fix the semiconductor wafer and the like, and the wafer or the like is cut into chips and then peeled off from the adhesive sheet by picking up. [0003] However, in this method, due to the physical stress generated by the dicing blade, defects such as chip flying or cracks and chips are caused, thereby causing a problem that the quality of these chips and the like is lowered, and the productivity of the dicing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02H01L21/78C09J7/21C09J7/22C09J7/24C09J7/25C09J7/29C09J7/38
CPCC09J7/0264H01L21/6836C09J2201/20H01L2221/68327C09J2203/326B26F3/004H01L21/78C09J7/04B23K26/1417B23K26/4075B23K26/146B23K26/40C09J7/22C09J7/21B23K2103/50Y10T428/26Y10T428/28Y10T442/10C09J2301/18H01L21/30B23K26/57
Inventor 浅井文辉佐佐木贵俊新谷寿朗高桥智一三木翼山本晃好
Owner NITTO DENKO CORP
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