Semiconductor integrated circuit and multi-chip module

Abstract

An internal circuit is arranged in the center portion of a semiconductor integrated circuit, and a plurality of two kinds of I / O circuits (1,2)for inputting and outputting signals from and to the outside and many pads are arranged along four sides of the semiconductor integrated circuit. The I / O circuits (2)are one of the foregoing two kinds are one-pad I / O circuits. The plurality of I / O circuits(1)that are of the other of the foregoing two kinds are two-pad I / O circuits on which two pads are arranged in zigzag relationship in a direction toward the internal circuit. The number of arranged pads equals to the number of pads required for the semiconductor integrated circuit. The one-pad I / O circuits and the two-pad I / O circuits are provided with power source wirings for supplying power thereto. The power source wirings extend along the arrangement direction of the one-pad I / O circuits and the second-pad I / O circuits to be ring-shaped. The power source wiring migration areas for changing power source wirings between the one-pad I / O circuits and second-pad I / O circuits are disposed in four corner portions of the semiconductor integrated circuit, thereby minifying the areas even in the semiconductor integrated circuit with more pads.

Description

technical field [0001] The present invention relates to a semiconductor integrated circuit having I / O circuits and pads, which are interfaces with the outside, on the peripheral portion, and more particularly to a semiconductor integrated circuit whose number of pads is relatively small relative to the scale of the internal circuit. Many semiconductor integrated circuits. Background technique [0002] Previously, in semiconductor integrated circuits as semiconductor chips, such as Figure 24 As shown, a plurality of I / O circuits 1 and pads 2 are arranged in a single stage on the outer periphery of the internal circuit 3 . [0003] In recent years, in response to the miniaturization of the process, more functions than before can be provided in one semiconductor integrated circuit, and the number of I / O circuits and pads provided as an interface with the outside is also increasing. However, low-voltage transistors used in memory circuits and logic circuits, and high-voltage t...

AI Technical Summary

Problems solved by technology

[0008] However, in the above-mentioned conventional semiconductor integrated circuit in which the pads are set to two levels, such as Figure 25 As shown, although the area can be reduced compared with the semiconductor integrated circuit in which the pads are provided in one level, even in the semiconductor integrated circuit in which the pads are provided in two levels, for example, five pads are redundant. , if 5 redundant pads 2 are set, it will be as Figure 26 As shown by the middle dotted line, the area will correspondingly increase the area required for the setting of the five redundant pads 2, thereby weakening the area reduction effect

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