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Spilled stannum port with external stannum baffle type stannum export

A technology of tin outlet and overflowing tin, applied in the field of tin furnace tin outlet, can solve the problems of inability to protect components, easy to form virtual welding of contacts, low work efficiency, etc., and achieve the effect of ensuring sufficiency and firmness

Inactive Publication Date: 2008-05-14
苏州明杰自动化科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. In addition, the usual design of the tin outlet cannot protect some components located in the area above the tin outlet, so as to avoid the contact between the components and the tin liquid. The present invention provides a simple structure, which can effectively improve the welding efficiency and ensure the welding joint The quality of the tin furnace can effectively protect the tin outlet of the components that do not need to be soldered above the tin outlet

Method used

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  • Spilled stannum port with external stannum baffle type stannum export

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Embodiment Construction

[0013] As shown in Figure 1, a kind of tin outlet with a tin baffle outside the overflow tin outlet, the shape of the tin outlet is rectangular, and at least one tin baffle 1 is arranged on the inner wall of the tin outlet of the tin outlet. At least one tin overflow opening 2 is opened around the tin outlet. The shape of the tin outlet is rectangular, and at least one tin overflow opening 1 is respectively arranged on the long side of the rectangle. The tin overflow opening 1 is a rectangular gap with a depth of 2-8mm.

[0014] As shown in FIG. 2 , the tin outlet of the present invention is mainly used in the case where there are some electronic components 4 that do not need to be soldered above the tin outlet. The tin baffle 1 installed at the tin outlet of the tin outlet blocks the tin liquid gushing out of the upper tin outlet, so that the tin liquid changes the flow direction after hitting the tin baffle 1 and diverts it from both sides of the tin baffle 1. Out of the ti...

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Abstract

The invention relates to a tin furnace part of PCBA board soldering tin, in particular a tin outlet of a tin furnace. The tin outlet is in a rectangle shape and is provided with at least a tin spill-way at the periphery, the two sides of which extend outward and has tin baffles of half-encircled structure. The tin spill-way is a rectangle opening with a depth of 2mm to 8mm. The invention has a simple structure and is capable of protection for soldering elements near the periphery of tin spilling effectively and realizing optional soldering for elements of the PCBA board above the tin outlet. Furthermore, oxidation layer on molten tin surface layer is effectively prevented from being retained on the surface of the PCBA board, and the quality of soldering spots is ensured.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin outlet of the tin furnace. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the tin outlet, resulting in a large area of ​​virtual soldering; for PCBA boards with denser solder joints, there is also a tin outlet structure, but the usual tin furnace outlet is designed as a flat opening. The soldering operation of the PCBA board generally needs to maintain a distance between the PCBA board and the tin outlet. On the one hand, it is ensured that the tin liquid sprayed from the tin outlet can solder the electrical components on the upper PCBA board. The tin liquid spraye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 严仕兴
Owner 苏州明杰自动化科技有限公司
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