45 results about "Selective soldering" patented technology

A universal automation line is configured for the assembly of electronics and mechanical devices. The universal automation line includes universal cells or stations that can be programmed to perform a variety of automated assembly tasks such as glue dispensing, screw driving, pick and place, etc. The stations are interchangeable by different module design such as selective soldering, heat stacking, bottom lead trimming, bottom screwing and ultrasonic welding. Each station can also include an automated robot, which is also interchangeable, to perform different tasks and complete fully automated assemblies. The stations can be sequenced inline for a fully automated line or combined with some manual operation. The stations can communicate by standardized interfaces and local networks, and can be expanded to an intranet or the internet for remote control.

The invention provides a method for achieving eutectic soldering of chips. The method comprises the steps of a, compressible areas in the chips are determined, and a photoetching mask panel is manufactured; b, conducting adhesives in the compressible areas of the chips are removed through a photoetching develop method on a gilded ceramic wafer; c, ball points, used as protruding points, are planted at the position, where the adhesives are removed, on the ceramic wafer through a gold ball bonding method; d, the ceramic wafer is cut into small ceramic wafers consistent with the chips in size through a gear cutting method; e, a tool locating clamp is manufactured according to the shapes of cavities to be welded, and a small ceramic wafer pressing block clamp with gold protruding points makes contact with non-circuit areas of the chips through the protruding points; f, a pressing block is arranged on the small ceramic wafer pressing block clamp, and vacuum compressible soldering of the chips is indirectly achieved. The gilded ceramic wafer is used as the base material, the mature photoetching technology and the ball-bonding ball planting technology are used for manufacturing the protruding points to provide effective mechanical support for soldering, and the method is wide in application range.

The invention discloses an eutectic chip soldering method. The method comprises the steps that dirt at the surfaces of a soldering lug and a piece to be soldered is removed, the soldering lug is cut, the piece to be soldered, the soldering lug and a chip are placed in a metal container, the metal container is placed in an atmosphere controllable eutectic furnace, the temperature curve of the atmosphere controllable eutectic furnace is set according to technical requirements, eutectic soldering is carried out on the piece to be soldered and the chip, air in the atmosphere controllable eutectic furnace is exhausted before temperature rise, nitrogen of the flow of 2L/min is filled in the temperature rise process, it is ensured that the soldering lug is fused, the vacuum degree in the furnace in the temperature decrease process is lower than or equivalent to 1 Pa and kept for 30 to 60s, so that gas in the chip and the piece to be soldered and gas generated by fusing of the soldering lug can be smoothly extracted under the self-gravity of the chip and the high-vacuum condition, and thus, the chip is soldered with the piece to be soldered via the pressure of self gravity on the piece to be soldered instead of using additional pressuring device. Thus, the surface quality of the chip during soldering is ensured, and the soldering process is simplified.

A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.

A latch that is waterproof or water-resistant so as to resist the entry of water through the latch. The latch can be a slam latch having a pawl with a shaft. A sealing element, for example, a collar and/or an O-ring, can be placed around the shaft of the pawl to resist water from entering through the latch. The pawl can also enclose the cavity in which the latch handle is maintained so water cannot enter through the cavity. Other measures, such as a gasket and selective welding, can also be implemented to improve the water-resistance of the latch.

The invention discloses a reciprocating selectivity crest welder control system. The reciprocating selectivity crest welder control system comprises a system controller, an actuator, a printed circuit board (PCB) plate, a first position sensor, a second position sensor, a foaming template nozzle, a preheating box, an electromagnetic pump, a transport motor, a solder machine lifting motor, a scaling powder lifting motor, an infra-red heating tube, a preheating temperature sensor, a first height sensor, a liquid-state stannum flow sensor, a second height sensor, a wave crest template nozzle, a third position sensor, a fourth position sensor, a fifth position sensor, a sixth position sensor, a foaming template side-direction motor and a wave crest template side-direction motor. The reciprocating selectivity crest welder control system combines the automatic control theory and motor dragging to achieve the function that a crest welder selectively welds the PCB plate, and the function of reciprocating weld is provided, so that the whole process can be finished without worker operation.

A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.

The invention discloses a reciprocating type printed circuit board (PCB) selective crest welder. The reciprocating type PCB selective crest welder is mainly comprises a selective scaling powder coating device, a pre-heating device, a welding device and a PCB transmission and positioning device. According to the reciprocating type PCB selective crest welder, a PCB to be welded is pre-heated after being coated with the selective scaling powder, selective welding is carried out on the PCB, and then the PCB is returned along the same track after the welding is finished, and therefore a reciprocating type welding process is achieved. The reciprocating type PCB selective crest welder is simple in structure, convenient to operate, high in precision, and universally applicable to selective welding of various PCBs.

A method for printing on a substrate, the method may include determining actual locations of substrate holes; printing a first ink on an object at locations that correspond to the actual locations of the substrate holes and curing the first ink to provide a holes mask; and wherein after the substrate is positioned on the object so that holes mask seals bottoms of the substrate holes then printing the second ink on the substrate thereby forming a predefined pattern on the substrate.

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

The invention discloses a pin type power single tube integration scheme applied to an electric control product of an electric vehicle, and relates to the technical field of a new energy vehicle. The pin type power single tube integration scheme comprises the following steps of firstly, pressing a pin type power device on a metal support plate by a press sheet or a press strip, wherein an insulation heat conduction gasket is arranged between the power device and the metal support plate; secondly, welding a pin of the power single tube and a bus capacitor on a thick copper printed circuit board (PCB); and finally, pressing the metal support plate integrated with the thick copper PCB on a cooling cold plate, wherein heat conduction silicon grease is coated between the metal support plate and the cooling cold plate. Compared with a package type power module, the cost is low, the design flexibility is greatly improved, the selective soldering or wave soldering feasibility of a power single tube pin is greatly improved, the power single tube is light in weight, the heat capacity of a product is low, and the welding quality is high; and the heat of the power single tube can be transversely diffused to the metal support plate, the cooling area is effectively extended, and the thermal resistance of the system is reduced.

The invention discloses a full-automatic control selective wave soldering device. The device is characterized by comprising a main body, a controller, a conveying guide rail, a scaling powder spraying mechanism, a double-layer preheating mechanism and a selective soldering mechanism, wherein the controller, the conveying guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective soldering mechanism are arranged on the inner side of the main body, the controller comprises a conveying controller, a spraying controller, a preheating controller and a soldering controller, the spraying controller comprises a pressure controller, a pressure sensor, a flowmeter and a pressure reducing valve, the pressure controller is connected with the pressure sensor, the flowmeter and the pressure reducing valve, the pressure sensor is mounted on a spraying valve, and the flowmeter and the pressure reducing valve are mounted on a spraying pipe at the bottom end of the spraying valve. Through the arrangement of the pressure sensor, the pressure controller, the pressure reducing valve, the flowmeter and other structures, the situation that the pressure of a sprayer on the spray valve is too high can be avoided; and through the arrangement of a temperature control chip, a temperature sensor and other structures, the situation that the temperature of the preheating controller in use is too high can be avoided.

The invention discloses a realization method and device for a multifunctional operational amplifier sampling front-end circuit. The method comprises the following steps of respectively configuring thesampling front-end circuit according to functions needing to be realized; and drawing the sampling front-end circuit on a PCB, and selectively welding peripheral devices of an operational amplifier according to the functions needing to be realized in order to realize the corresponding functions. The device comprises an input interface end, a middle conversion end and a voltage stabilization output end. The method and the device have the advantages of being simple to operate, good in universality and wide in application range and capable of realizing various sampling circuit functions.

Solder is pumped through a nozzle to produce a jet 12 of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle 2 is mounted on a flange 16 held between slip rings 18, 20 so that the nozzle can be rotated to change the direction of the jet. A nitrogen conduit 68, 70 may be provided in-line with the jet to provide a nitrogen atmosphere. A thin plate 92 downstream of the nozzle outlet to contact the jet and inhibit sideways fluctuations when leads are passed sideways through the jet. The apparatus may also include a tube 204, 212, 224 for delivering heated nitrogen gas to pre-heat a region to be soldered.

Solder pot intended for a machine for selective soldering of through-hole electronic components on a printed circuit board, characterized in that it is in the form of a right prism, preferably with a hexagonal base.