45 results about "Selective soldering" patented technology

A selective soldering apparatus comprises a bath (3) for molten solder (5), a solder nozzle (19) and a pump (9) for pumping molten solder (5) through the nozzle (19). The nozzle has a nozzle body (21) with an inner bore (22) through which solder is pumped to overflow a nozzle outlet (33). A jacket (23) provided around the nozzle body (21) to form an enclosed space (26) open at its upper end (28) to solder which has overflowed from the nozzle outlet (33) and the cover lower end being adjacent the surface (11) of molten solder in the bath, wherein a spiral pathway (25) is provided in the enclosed space (26) so that the overflowed solder runs down the pathway into the solder bath (3). A port (39) is provided at the lower end of the jacket for gas to flow into or out of the spiral pathway so that the pathway can be purged of air when solder is not flowing through the pathway.

A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.

A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.

The invention discloses a pin type power single tube integration scheme applied to an electric control product of an electric vehicle, and relates to the technical field of a new energy vehicle. The pin type power single tube integration scheme comprises the following steps of firstly, pressing a pin type power device on a metal support plate by a press sheet or a press strip, wherein an insulation heat conduction gasket is arranged between the power device and the metal support plate; secondly, welding a pin of the power single tube and a bus capacitor on a thick copper printed circuit board (PCB); and finally, pressing the metal support plate integrated with the thick copper PCB on a cooling cold plate, wherein heat conduction silicon grease is coated between the metal support plate and the cooling cold plate. Compared with a package type power module, the cost is low, the design flexibility is greatly improved, the selective soldering or wave soldering feasibility of a power single tube pin is greatly improved, the power single tube is light in weight, the heat capacity of a product is low, and the welding quality is high; and the heat of the power single tube can be transversely diffused to the metal support plate, the cooling area is effectively extended, and the thermal resistance of the system is reduced.