27 results about "Selective soldering" patented technology

Provided in the present invention are a fully-automatic selective soldering system and method for a PCB. The fully-automatic selective soldering system comprises the following components arranged in sequence: a soldering flux spray-coating mechanism; a first conveying mechanism, which is used for conveying a PCB to a spray-coating station of the soldering flux spray-coating mechanism; a preheating mechanism, which is used for preheating the PCB after spray-coating, wherein a third conveying mechanism is provided inside the preheating mechanism; a second conveying mechanism, which is used for conveying the preheated PCB to a position above a rotary soldering mechanism; and the rotary soldering mechanism, which is used for performing soldering of the preheated PCB. The soldering flux spray-coating mechanism is located below the first conveying mechanism; the rotary soldering mechanism is located below the second conveying mechanism; and the first conveying mechanism and the second conveying mechanism are respectively connected to two ends of the third conveying mechanism. Such a configuration simplifies the structure of a conveying portion, making the overall structure of an apparatus more compact, and also significantly shortens the conveying path of a PCB between processes, thereby significantly improving working efficiency.

Soldering nozzle (10) for selective soldering, comprising a base body (12) extending along a longitudinal axis (L), with a nozzle base (14) having a solder inlet opening (16), with a solder outlet (18) for forming a solder wave, wherein the solder outlet (18) has a solder outlet opening (20), wherein the solder inlet opening (16) and the solder outlet opening (20) are spaced apart from one another and connected by a solder channel (22), wherein separating elements (24) are provided in the solder outlet opening (20). It is provided that the base body (12) has a base region (26) extending from the nozzle base (14) and in the direction of the solder outlet (18) and having a cross section (QB) with an at least largely round outer contour (AB), and an outlet region (28) extending from the solder outlet (18) and in the direction of the nozzle base (14) and having a cross section (QA) with an at least largely square outer contour (AA).

The utility model relates to the technical field of welding, in particular to selective soldering tin equipment which comprises a bottom box, first electric guide rails, second electric guide rails and the like, two groups of first electric guide rails are mounted at the bottom in the bottom box, each group comprises two first electric guide rails, and the second electric guide rails are jointly mounted on sliding blocks of the two first electric guide rails in the same group. The first electric guide rail and the second electric guide rail can be controlled to operate through the PC control systems, the tin pots are moved to the positions below the defective welding spots, then the PC control systems control the telescopic rods of the lifting air cylinders to stretch out and draw back, the tin pots are driven to move up and down, repair welding is conducted on the defective welding spots, the two PC control systems and the two tin pots form two stations, and welding efficiency is improved. When one workpiece breaks down, the operation of the other workpiece cannot be affected, the working efficiency is ensured, the machining time and requirements of different workpieces are different, and the working efficiency can be improved through separate control.

A soldering tip for a soldering apparatus and a method of forming a soldering tip for a soldering apparatus, the tip comprising: a body formed of a first material; a proximal end for attaching the tip to the selective soldering apparatus; and a distal end, the distal end having an outer surface, at least a region of which is formed from a second material, different to the first, the second material exhibiting greater solder wettability characteristics than the first material. The first material is preferably titanium or a titanium alloy and the region is preferably formed on the first material by first using a physical vapour deposition (PVD) process to create a first coating on at least a first part of the first material, which first part underlies the region, and then coating at least a part of that first coating with the second material.

This invention provides a fully automated selective soldering system and method, comprising: a flux spraying mechanism arranged sequentially; a first conveying mechanism for conveying a PCB board to the spraying station of the flux spraying mechanism; a preheating mechanism for preheating the sprayed PCB board, wherein the preheating mechanism includes a third conveying mechanism; a second conveying mechanism for conveying the preheated PCB board above a rotary soldering mechanism; and a rotary soldering mechanism for soldering the preheated PCB board. The flux spraying mechanism is located below the first conveying mechanism, and the rotary soldering mechanism is located below the second conveying mechanism. The first and second conveying mechanisms are respectively connected to both ends of the third conveying mechanism. This arrangement simplifies the structure of the transmission section, making the overall equipment structure more compact; and significantly shortens the path of the PCB board between different processes, resulting in a substantial improvement in work efficiency.

This invention relates to the technical field of solder level detection, and particularly to a solder level height detection device and method for selective soldering equipment. The device includes: a solder pot, comprising a pot body and a pot cover, the pot cover having a recessed observation tube extending from the outside of the pot body to the inside of the pot body; a drive control assembly for driving the solder pot to rotate in the X, Y, and Z axes; a laser sensor for detecting the solder level in the solder pot via the recessed observation tube; and a control module, comprising: a receiving unit for receiving a level detection command and for receiving the detection value from the laser sensor; a control unit for responding to the level detection command by driving the solder pot to a preset coordinate and controlling the laser sensor to perform detection; a judgment unit for judging whether the detection value falls within a preset range; and an alarm unit for issuing an alarm message if the detection value does not fall within the preset range. This application has the effect of improving detection accuracy and equipment compatibility.

The invention relates to the technical field of PCBA (printed circuit board assembly) welding, in particular to PCBA selective welding equipment with reinspection AOI (automatic optical inspection), which comprises a frame body, a feeding device movably arranged on the frame body, a visual positioning device matched with the feeding device for use and a welding device matched with the feeding device for use, the feeding device is used for feeding PCBA boards to be machined, the visual positioning device is used for conducting visual positioning on the PCBA boards to be machined borne by the feeding device, the welding device is used for conducting welding treatment on the PCBA boards subjected to visual positioning, the frame body is provided with a control system, and the feeding device, the visual positioning device and the welding device are all electrically connected with the control system. Automatic visual inspection is achieved, welding parameters are adjusted in a targeted mode, the welding requirement of a high-quality circuit board is met, the situation of poor welding is avoided, the production cost is reduced, and the welding efficiency and the welding quality are improved.

Embodiments of the present invention relate to the technical field of circuit board manufacturing processes, and disclose a method for manufacturing a circuit board and a circuit board, including preparing a substrate, providing a selective soldering jig and a plurality of IGBT components, placing the plurality of IGBT components on a first surface, with one IGBT component located at a soldering position, plugging a pin of an IGBT component into a first socket, placing the substrate with the plurality of IGBT components on a first base plate assembly, placing a pressure plate assembly on one side of the first base plate assembly, placing a functional board assembly on the other side of the first base plate assembly, and abutting an IGBT component with the other end of an elastic abutment member passing through the first base plate assembly and a first through hole to push the IGBT component toward the abutment block, soldering the pins of the plurality of IGBTs to a second surface through a first soldering port, and after soldering the pins of the plurality of IGBTs is completed, removing the selective soldering jig to obtain a circuit board. Through the above-described method, the embodiments of the present invention can ensure that after soldering, the plane of the plurality of IGBT components facing away from the substrate is in the same plane.

The invention relates to a heating module with a reflector diaphragm for a selective brazing apparatus, a selective brazing apparatus and an associated method.

The utility model provides a DIP welding selection checking device which comprises a supporting assembly, the top of the supporting assembly is provided with a jig assembly, and the jig assembly comprises a jig plate, a receding hole, a detection hole, scale marks, a mounting groove and an electronic level meter. Yielding holes and detection holes are uniformly formed in the upper surface of the jig plate, scale marks are uniformly formed in the upper surface of the jig plate, the scale marks are arranged on one side of the yielding holes, and a mounting groove is formed in the upper surface of the jig plate. The jig plate is placed on the top of the supporting assembly, the levelness of the jig plate is detected through the electronic level meter, the levelness of the supporting assembly can be rapidly detected, the welding precision of DIP selective welding is guaranteed, and the product quality is improved. The position of the welding spot is represented through the detection hole, and the deviation between the coordinate position of the DIP selective welding flux and the preset position is detected through the position of the detection hole, so that the deviation distance is rapidly analyzed, and the DIP selective welding calibration precision is improved.

The utility model relates to the field of PCB (Printed Circuit Board) processing, and particularly discloses a selective welding protection jig which comprises a base; the jig seat assembly is connected with the base; the protection frame assembly is connected with the jig seat assembly in a sliding manner; the partition frame assembly is movably connected with the protection frame assembly in an inserted mode and used for being matched with the protection frame assembly to complete welding isolation. Wherein the protection frame assembly comprises a sliding frame assembly, and the sliding frame assembly is connected with the jig seat assembly in a sliding mode; the heat dissipation assembly is connected with the top side of the sliding frame assembly and used for assisting heat dissipation, the jig can achieve welding area isolation through the sliding frame assembly and the partition frame assembly, different elements on a plate can adopt different temperatures and welding time, the elements which are not resistant to high temperature are protected, and meanwhile the heat dissipation assembly is used for assisting heat dissipation. And the heat dissipation assembly communicating with the partition frame assembly is arranged, and the heat gas discharging speed close to the welding position of the plate is further increased.

A selective soldering machine configured to adjust a solder wave provided by a selective soldering nozzle based on at least one property detected by an image sensor of the selective soldering machine. The selective soldering nozzle may be configured to provide a solder wave to solder a portion of a workpiece. The image sensor may be configured to detect at least one property of the selective soldering nozzle and / or the solder wave in real-time. The selective soldering machine may include a controller that is configured to adjust the solder wave provided by the selective soldering nozzle based on the at least one property detected by the image sensor.

The invention relates to a solder nozzle (10) for a selective soldering process, comprising a main part (12), which extends along a longitudinal axis (L) and which comprises a nozzle base (14) with a solder inlet opening (16), and a solder outlet (18) for forming a solder wave, wherein the solder outlet has a solder outlet opening (20), and the solder inlet opening and the solder outlet opening are mutually spaced and connected together by a solder channel (22). The main part has a base region (26) which starts from the nozzle base and extends in the direction of the solder outlet, said base region having a cross-section with an at least largely round outer contour (AB), and the nozzle base encloses a nozzle base cross-sectional area. The main part has an outlet region (28) which starts from the solder outlet and extends in the direction of the nozzle base to the base region, said outlet region having a cross-section with an at least largely rectangular outer contour (AA), and the solder outlet encloses a solder outlet region cross-sectional area. The outer contour of the outlet region forms an outer surface which predominantly runs parallel to the longitudinal axis, and the nozzle base cross-sectional area is larger than the solder outlet region cross-sectional area.

The utility model discloses a kind of wear-resistant PCB board selection welding jigs, comprising: substrate, its corner is equipped with assembly slot;Wear plate, its split positioning is on assembly slot;Bump, its positioning is at the bottom of wear plate, it is engaged with chain for jig conveying;Guide strip, it is set to the side of wear plate, it is abutted with the side of chain.The utility model's selection welding jig can greatly slow down the wear rate of corner after jig use, improve its service life, so that the conveying of chain to jig is more stable.Through bump and chain engagement butt joint, guide strip and chain side abut, to replace the synchronous driving conveying mode of traditional jig by the friction force of bottom and chain with multi-surface friction fit structure direct pushing composite driving mode, to further reduce jig wear, wear plate can be disassembled, replace, to reduce jig use cost, ensure the stability of its conveying.

This application provides a display device and its display panel. The display device includes a display panel comprising a display area and a bonding area. The display area includes a first side and a second side opposite to each other, and the bonding area is located on the first side. The display panel includes a first display panel and a second display panel whose second sides are spliced ​​together to form a display device with a large display area. Furthermore, the display panel has redundant electrodes, allowing for selective soldering of light-emitting elements of corresponding colors onto the display panel according to display requirements during the fabrication of the display device, avoiding the problem of single-color dot misalignment after splicing the display panels. Additionally, the redundant electrodes in the display panel allow for the soldering of corresponding light-emitting elements onto the first display panel and the second display panel respectively during the fabrication of the display device, eliminating the need to fabricate two display panels with different substrates, thus simplifying the fabrication process of the display device.

Methods and apparatus for applying molten solder are disclosed. A system for applying solder to a workpiece includes a conveyor for moving a first workpiece along a machine direction, and a first selective soldering nozzle to apply solder to the first workpiece while the first workpiece is moving along the machine direction. The system can also include a flux application area to apply flux to bottoms of workpieces, a heating area to heat the bottoms of the workpieces, and a conveyor to convey the workpieces. The workpiece can constantly move through multiple areas, such as a flux application area, a heating area, and a selective soldering area. As such, two or more areas can operate on the workpiece simultaneously and while the workpiece is moving. The method includes applying solder from the first selective soldering nozzle to the first workpiece while the first workpiece is moving along the machine direction.

The invention provides a manufacturing method of a circuit board assembly, and the method comprises the steps: arranging a first frame plate and a second frame plate which are different in thickness on the same surface of a first circuit board, welding a second circuit board on the first frame plate, and welding a third circuit board on the second frame plate in a laser welding manner. At least one time of reflow soldering is replaced by laser soldering, the laser soldering belongs to selective soldering, and compared with the reflow soldering, the laser soldering does not need to place the electronic component and the circuit board in a high-temperature environment, so that the reflow soldering frequency is reduced equivalently, and the frequency of the electronic component in the high-temperature environment is further reduced; and the risk that electronic components are damaged can be reduced. The invention further provides a circuit board assembly and a terminal device.

A selective wave soldering system (10) for selective wave soldering of circuit boards includes a solder can (40) comprising a solder nozzle (22) detachably mounted on the solder can (40), wherein the solder nozzle (22) has a nozzle base and a nozzle neck (56), wherein a nozzle opening is provided at the free end of the nozzle neck (56), the solder can (40) is mounted on a moving unit (16) movable in the horizontal plane along the x and y axes and in the vertical direction along the z axis (44), and includes a control unit (32) for controlling the moving unit (16), characterized in that... The hopper (20) for receiving different solder nozzles (22) is arranged on the moving unit (16), characterized in that a clamping unit (34) is provided, the clamping unit (34) including clamping fingers (38) for clamping the solder nozzles (22), wherein the clamping unit (34) can be moved along the z-axis by a drive unit (36) controlled by a control unit (32), and wherein the control unit (32) is designed to control the moving unit (16), the drive unit (36) and the clamping unit (34) such that the solder nozzles (22) in the hopper (20) can be clamped, lifted and lowered in the solder can (40) by the clamping unit (34).

The invention relates to a calibration tool (1) for calibration for a selective welding device (100), comprising a workpiece carrier unit (2) for receiving at least one or more workpieces (3) and at least one workpiece, such as a printed circuit board (4), and at least one measuring unit (3a). Wherein the measuring unit (3a) is designed as a distance measuring unit (5), which can be accommodated within the workpiece carrier unit (2) for calibrating a distance (2b) of a bearing surface (2a) of the workpiece carrier unit (2) to at least one welding tip (6) of the welding unit (101); or is designed as at least one temperature measuring unit (7) which can be accommodated within the workpiece carrier unit (2) for calibrating at least one heating power of the preheating unit (102); the welding unit (101) is designed as a workpiece carrier unit (2) or as at least one wave height measuring unit (8) which can be accommodated within the workpiece carrier unit (2) in order to calibrate a wave height (9) at at least one welding tip (6) of the welding unit (101).

The invention relates to a method for establishing a signal connection (49) between at least one power module (10, 94, 96, 98) and a control circuit board (40), comprising the following method steps: According to a), a wiring plane (26) is provided on at least one power module (10, 94, 96, 98) having metal connecting surfaces (64) for architecture elements (18, 20, 38, 50) of the signal connection (49). According to method step b), the architecture elements (18, 20, 38, 50), in particular pin feet (58), and the metal connecting surfaces (64) are integrally joined, and a head region (60) of the architecture elements (18, 20, 15, 38, 50) of the signal connection (49) is then joined to the control circuit board (40) by pressing or selective soldering (56, 108) into the control circuit board.

The utility model discloses a kind of general fixture for PCBA selective welding, comprising: gluing fixture, protective gasket and welding tray, multiple groups of placement grooves for placing PCB board are set up on gluing fixture, limiting groove corresponding to the placement groove is set up on welding tray, the clearance for PCB board main body is provided on protective gasket, the periphery of clearance on protective gasket is provided with several avoidance hole groups for the lead through on PCB board, limiting groove is provided with the shielding plate for protecting SMT element on PCB board, the edge of the frame of shielding plate and the edge of the limiting groove form first hollow position, second hollow position and third hollow position, at least two groups of positioning holes are provided on the four periphery of the gluing fixture, guiding column is provided on welding tray, which is matched with positioning hole and is installed, the utility model realizes two-in-one when jig welding, reduces the frequent taking and placing board action of personnel, improves operation efficiency.

The utility model relates to the technical field of wave soldering, in particular to an efficient heat dissipation selective wave soldering device for an IGBT (Insulated Gate Bipolar Translator) module. The device comprises a base, a lifting frame is fixedly connected to the upper portion of the base, a pair of symmetrically-arranged limiting assemblies are arranged at the top of the base, a driving assembly is fixedly connected to the bottom of the lifting frame, a selective welding assembly is fixedly connected to one side of the driving assembly, and the driving assembly is used for driving the selective welding assembly to move. Selective welding is conducted on the to-be-welded IGBT module fixed between the limiting assemblies through the selective welding assembly; according to the IGBT module selective wave soldering device with the efficient heat dissipation function, the arranged driving assembly is used for driving the selective soldering assembly to move, selective soldering is conducted on the to-be-welded IGBT module fixed between the limiting assemblies through the selective soldering assembly, and meanwhile the limiting assemblies are used for fixing the to-be-welded IGBT module; and carrying out fixed-point welding on the IGBT module by selecting the welding assembly.

1. The name of the design product: double-station selective soldering machine. 2. The use of the design product: the design product is used as a double-station selective soldering machine. 3. The design points of the design product: in shape. 4. The picture or photo best indicating the design points: perspective view 1.

The invention discloses a full-automatic production process of a GMOV composite element, and belongs to the technical field of automatic manufacturing of electronic elements. According to the method, lead forming and tinning, positioning and leveling, visual guiding element assembling, controllable atmosphere preheating and selective welding, AI intelligent detecting and sorting, cleaning and double-coating coating and full-process data tracing are sequentially carried out. According to the technology, through full-process automatic integration, the defects that in a traditional production mode, procedures are dispersed, manual operation is relied on, the positioning precision is low, and quality fluctuation is large are overcome, and high-precision assembly and high-reliability welding are achieved. And meanwhile, intelligent quality detection and cloud data tracing are combined, so that the production efficiency and the product consistency and reliability are remarkably improved, the full-life-cycle quality management of a single product is realized, and the method is suitable for large-scale and high-quality manufacturing requirements of GMOV elements.

The invention relates to a method for producing a signal connection (49) between at least one power module (10, 94, 96, 98) and a control board (40) comprising the following method steps: According to a), a wiring level (26) is provided on at least one power module (10, 94, 96, 98) with metallic connection surfaces (64) for architectural elements (18, 20, 38, 50) of the signal connection (49). After process step b), the architectural elements (18, 20, 38, 50), in particular pin feet (58), and the metallic connection surfaces (64) are joined by a material bond, followed by joining a head area (60) of the architectural elements (18, 20, 38, 50) of the signal connection (49) to the control board (40) by pressing or selectively soldering (56, 108) into it.

The utility model discloses an automatic selective welding tool, belongs to the technical field of welding, and solves the technical problems of poor compatibility and high cost of a selective welding tool in the prior art. The device comprises a supporting base, a product bearing station is arranged on the supporting base, the supporting base comprises a bottom plate, a plurality of product containing grooves are formed in the bottom plate, product adjusting parts are arranged on the product containing grooves, each product adjusting part comprises an adjusting sliding block and a locking adjusting screw, and the adjusting sliding blocks are connected with the locking adjusting screws. The product containing groove used for containing the product is formed in the bottom plate of the supporting base, the product adjusting part is arranged on the product containing groove, the position of the adjusting sliding block can be adjusted by adjusting the locking adjusting screw, then the compatible size of the welded product can be adjusted, and through the convenient and fast adjustable structural design, the welding quality is improved. The tool can be suitable for welding products of various models, the product compatibility of the welding tool is improved, model changing is reduced, and cost is saved.

The application discloses a selective soldering machine with a solder pump capable of intelligent switching, which comprises a machine cover, a PCB clamping and conveying device and a solder pump intelligent switching device. A PCB feeding port is formed in the middle of the left end face of the machine cover, and a PCB discharging port is formed in the middle of the right end face. The PCB clamping and conveying device is fixedly arranged in the machine cover along the left-right direction, and the left and right ends of the device correspond to the PCB feeding port and the PCB discharging port. The solder pump intelligent switching device is fixedly arranged in the machine cover and located below the PCB clamping and conveying device, and has two solder pumps arranged upwards and capable of switching the welding positions in a rotating mode. The two solder pumps are switched in a rotating mode, so that the occupied space of the whole device can be greatly reduced. The two solder pumps are switched in a rotating mode, so that the operation is simple, and the movement paths of the two solder pumps are relatively short, so that the running speed is high, and the working efficiency of the soldering machine can be effectively improved.