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Apparatus and method for selective soldering

A selective, soldering technology, applied in the direction of tin feeding device, welding equipment, printed circuit assembly of electrical components, etc., can solve the problem of increasing error rate of metal scrap, reduce pollution level and error rate, improve welding quality, and improve efficiency improved effect

Inactive Publication Date: 2011-12-07
LINDE AG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Likewise, minor inerting during the welding process and the associated increase in metal scrap and increased error rates are defects to be mentioned

Method used

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  • Apparatus and method for selective soldering
  • Apparatus and method for selective soldering
  • Apparatus and method for selective soldering

Examples

Experimental program
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Embodiment Construction

[0031] figure 1 A container 10 for liquid solder is shown, which contains a so-called solder bath 9 with solder channels 2 . The drawing further shows three nozzles 4 mounted on the solder channel 2 . In this example, the solder channel 2 is generally embodied as a pressure channel and is closed to the surrounding environment. Solder channel 2 on figure 2 Only part of it is drawn.

[0032] The nozzle 4 is mounted on the solder channel 2 in the region of the cover sheet 3 and is secured by said solder channel 2 . In order to pressurize the liquid solder 1, a structure of a solder pump (not shown) is provided. The solder channel 2 is surrounded by a vertically movable cover 5 which is immersed in the solder bath 9 or otherwise sealed to the surface of the solder bath 9 . A channel 7 for each nozzle 4 is provided in the cover 5 . Furthermore, in this example two protective gas delivery devices 6 are provided, which achieve the purpose of delivering the protective gas under...

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Abstract

The invention relates to a device for selective soldering comprising a container (10) for liquid solder containing a so-called solder bath (9) with a solder channel (2) and a At least one nozzle (4) on the top, also with a solder pump for pressurizing the liquid solder (1) in the solder channel (2), characterized in that the solder channel (2) is covered by a vertically movable cover (5) Surrounded, the shroud is immersed in the solder bath (9) or is otherwise sealed to the surface of the solder bath (9), the shroud includes a passage (7) for each nozzle (4) and is Below the cover (5) is provided with at least one protective gas and / or active gas delivery device (6), wherein on the cover (5) is attached a flow plate ( 8). The invention further relates to a method of selective soldering.

Description

technical field [0001] The invention relates to a device for selective soldering comprising a liquid solder container containing a so-called solder bath with a solder channel and at least one nozzle mounted on the solder channel with a pair of A solder pump that pressurizes the liquid solder in the solder channel. The present invention further relates to a method for selective soldering. Background technique [0002] Selective soldering is a well-established method for soldering electronic components. It has proven to be particularly advantageous especially for large and bulky components, such as transformers, plugs, electrolytic capacitors and others, which are subject to high mechanical stress, for example, preferably said components according to the so-called push-through technique in the selective soldering method ( push-through technique) for welding. The selective soldering method can be considered as a spot soldering technique, for most parts the liquid solder is a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/08B23K101/42H05K3/34B23K3/06
CPCB23K2201/42H05K2203/0763H05K3/3447H05K3/3468B23K3/0684B23K1/085B23K2101/42
Inventor H·艾斯勒E·万德克
Owner LINDE AG
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