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Full-automatic selective wave soldering device

A wave soldering and selective technology, applied in electric heating devices, auxiliary devices, welding equipment, etc., can solve the problem of not being able to save flux and reduce energy consumption, so as to reduce welding operating costs, save labor costs, and adjust the heating power. Effect

Pending Publication Date: 2020-12-08
HUANGSHAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of this application is to provide a fully automatic selective wave soldering device, which solves the problem that there is no wave soldering in the prior art that can save flux, reduce energy consumption, and has strong consistency, repeatability, reliability and traceability. Program technical issues

Method used

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  • Full-automatic selective wave soldering device
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  • Full-automatic selective wave soldering device

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Embodiment

[0047] Such as Figures 1 to 10 as shown, figure 1 It is a structural schematic diagram of a fully automatic selective wave soldering device in this embodiment; figure 2 It is a structural schematic diagram of a spraying, preheating and welding mechanism of the fully automatic selective wave soldering device in this embodiment; image 3 It is a structural schematic diagram of a transport rail of the fully automatic selective wave soldering device in this embodiment; Figure 4 It is a structural schematic diagram of a flux spraying mechanism of the fully automatic selective wave soldering device in this embodiment; Figure 5 It is a schematic structural diagram of a vertical biaxial moving platform of a flux spraying mechanism of a fully automatic selective wave soldering device in this embodiment; Figure 6 It is a structural schematic diagram of a vertical dual-axis mobile platform applied to a flux spraying mechanism of a fully automatic selective wave soldering device i...

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Abstract

The invention provides a full-automatic selective wave soldering device which comprises a transportation guide rail, a scaling powder spraying mechanism, a double-layer preheating mechanism, a selective soldering mechanism and a controller. The transportation guide rail is provided with a spraying fixing position, a preheating fixing position and a soldering fixing position, and is provided with asliding tray sliding along a board inlet guide rail and a board outlet guide rail, and a printed circuit board to be soldered is placed on the sliding tray. The scaling powder spraying mechanism is located at the spraying fixing position and located below the sliding tray and comprises a vertical double-axis moving table and a scaling powder sprayer. The double-layer preheating mechanism is located at the preheating fixing position and comprises an upper preheater and a lower preheater. The selective welding mechanism is located at the welding fixing position and located below the sliding tray and comprises a vertical three-axis moving table and a soldering tin furnace. The controller is connected with the conveying guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism. By means of the full-automatic selective wave soldering device, scaling powder can be saved, energy consumption is reduced, and automatic wave soldering with high consistency, repeatability, reliability and traceability is achieved.

Description

technical field [0001] The present application relates to the technical field of soldering, in particular to a fully automatic selective wave soldering device. Background technique [0002] Wave soldering is a welding process that makes the soldering surface of the plug-in board directly contact with high-temperature liquid tin. The high-temperature liquid tin maintains a slope, and a special device makes the liquid tin form a wave-like phenomenon, so it is called "wave soldering". Its main material is solder bar. With the high density and miniaturization trend of electronic product production process, the surface mount technology (Surface Mounted Technolog, abbreviated as SMT) technology develops rapidly, the traditional wave soldering process can no longer meet the welding needs of the remaining few perforated components, and manual It is difficult to achieve high-quality and high-efficiency welding for large heat capacity or fine-pitch components, and the cost advantage ...

Claims

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Application Information

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IPC IPC(8): B23K1/08B23K3/00B23K3/04B23K3/08
CPCB23K1/085B23K3/00B23K3/04B23K3/08B23K3/087
Inventor 曹建华杨超施云贵郭东旭刘胜荣褚园林玉屏钱胜
Owner HUANGSHAN UNIV
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