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Device for selectively welding through-hole component and welding method

A welding device and welding method technology, applied in the directions of tin feeding device, auxiliary device, welding equipment, etc., can solve the problems of uneven spraying, complex programming, low work efficiency, etc., and achieve the effect of uniform coating

Inactive Publication Date: 2009-01-28
FORYOU GENERAL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Welding point by point, the work efficiency is low, not suitable for mass production, if you need to increase the production capacity, you must increase the welding head, resulting in an increase in equipment costs
[0004] Existing flux coating for selective soldering adopts spray coating, and the spraying is uneven. When coating, X-Y servo mechanism is used for spraying, and the project cost is high, and X-Y servo mechanism spraying requires complicated programming. Contamination will affect product reliability
Component preheating consumes a lot of power, and energy saving and environmental protection cannot be achieved. After the welding is completed, the angle of the solder joints on the components is not considered, and the technical problem of solder joint tinning cannot be effectively solved. Inconsistent height, many welding problems

Method used

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  • Device for selectively welding through-hole component and welding method
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  • Device for selectively welding through-hole component and welding method

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Embodiment Construction

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] Please refer to Fig. 1 and Fig. 2, it is a preferred embodiment of the selective soldering device for through-hole components of the present invention, which includes a flux coating container 1 filled with flux, a preheating device 2 and a soldering device 4, so The flux coating container 1 is an airtight container, which can spray flux on the parts (PCB 3 in this embodiment) that need to be coated, and the preheating device 2 can preheat the PCB 3, and the soldering device 4 Solder the place where the PCB board 3 needs to be welded. The flux is an organic ...

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PUM

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Abstract

The invention provides a device for selective welding an apparatus of a through hole and method thereof, which includes a flux spraying container which sprays the flux to the apparatus, a pre-heating device which preheats the apparatus and a welding device which carries out tin-spraying welding on the apparatus; the flux spraying container includes a foaming device which brings out the foams of the flux by entering air, a pore for the outlet of the foams and a spraying module which sprays the flux on the apparatus. The foaming device is arranged in the flux spraying container; the pore is arranged on the foaming device; the spraying module is arranged on the flux spraying container; the spraying module is opposite to the position on the apparatus needing to be sprayed with the flux. The foams of the flux of the selective welding device for an apparatus of a through hole get out from the pore of the foaming device and assemble in the foaming device with a large amount to carry out spraying on the place on the apparatus needing to be sprayed from the spraying module; a foaming jetting mode is adopted for realizing selectively uniform spray of the flux.

Description

【Technical field】 [0001] The invention relates to a selective device for through-hole components and a welding method. 【Background technique】 [0002] In the development of modern electronic soldering technology, it has changed from through-hole soldering technology to surface mount soldering technology. Although surface mount technology has become the mainstream of electronic product assembly technology, through-hole soldering technology still occupies an important position in the electronic assembly industry. One place: Some components, such as connectors, sensors, transformers and shielding covers, still cannot be completely surface-mounted; due to cost and other reasons, many companies still consider through-hole components in the selection of components; In industries such as national defense, automotive and high-end communications, in order to pursue the reliability of solder joints under extreme conditions, through-hole components are still the best choice (soldering ...

Claims

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Application Information

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IPC IPC(8): B23K3/00B23K3/06B23K3/08
Inventor 王海鸥
Owner FORYOU GENERAL ELECTRONICS
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