Epoxy resin composition for multi-chip package and multi-chip package using same

A technology of multi-chip packaging and epoxy resin, which is applied in transportation and packaging, other chemical processes, semiconductor/solid-state device components, etc., and can solve problems such as weak moisture resistance of organic films, cracked packages, and weak adhesion

Active Publication Date: 2008-05-28
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, since the adhesive force of the die-bonding film is weak, peeling between the chip and the bonding film is easy to occur, and the moisture resistance of the organic film is also weak, so the package cracking is easy to occur

Method used

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  • Epoxy resin composition for multi-chip package and multi-chip package using same
  • Epoxy resin composition for multi-chip package and multi-chip package using same
  • Epoxy resin composition for multi-chip package and multi-chip package using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1、2 and comparative example 1-3

[0072] In order to prepare the epoxy resin composition for encapsulating semiconductor elements of the present invention and the epoxy resin composition that does not contain a hydrocarbon group-containing hydroxysiloxane resin as a comparative example, after weighing each component as shown in Table 1, use Henscher Mix uniformly with a Miel mixer to prepare a primary composition in a powder state, and then use a kneader to melt and mix in the range of 100-120° C., and then undergo cooling and pulverization to prepare an epoxy resin composition.

[0073] Table 1

[0074] Composition

Example 1

Example 2

Comparative example 1

Comparative example 2

Comparative example 3

epoxy

resin

1) Biphenyl type epoxy resin

2.92

2) Aralkylphenolic epoxy resin

2.72

brominated epoxy resin

0.50

Antimony trioxide

0.50

to solidif...

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Abstract

The invention provides an epoxy resin composition for a multi-chip package. The epoxy resin composition comprises an epoxy resin, a solidifying agent, a solidification promoting agent, a coupling agent and an inorganic filling agent. The invention is characterized in that the coupling agent includes a hydroxide radical siloxane resin comprising an alkyl. The epoxy resin composition has good property in the formation aspect at the same time of having excellent reliability.

Description

technical field [0001] The present invention relates to an epoxy resin composition for multi-chip packaging, and relates to an epoxy resin composition having good adhesion properties to metal components, moisture resistance properties, crack resistance at high temperature and mechanical properties, and excellent reliability and formability. Background technique [0002] Recently, the integration level of semiconductor elements has been increasing, and at the same time, the miniaturization of wiring, the enlargement of elements, and the multilayer wiring have rapidly progressed. On the other hand, from the viewpoint of high-density mounting on printed circuit boards, that is, surface mounting, packages (Packages) for protecting semiconductor elements from the external environment are rapidly progressing toward miniaturization and thinning. [0003] In a resin-sealed semiconductor device in which a large semiconductor element is sealed in a small, thin package as described abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C08L63/00H01L23/29
CPCH01L23/296C08G59/245C08G59/621H01L2224/32145H01L2224/32225H01L2224/48091H01L2224/48471H01L2224/48479H01L2224/73265H01L2924/15311H01L2924/1461H01L2924/00014Y10T428/31529H01L2924/00H01L2224/4554C08L63/00C08K3/00C08L83/04
Inventor 裴庆彻金真儿朴闰谷
Owner CHEIL IND INC
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