Information recording medium and method for producing the same
A technology for information recording and manufacturing methods, which is applied in the manufacture of optical record carriers, temperature recording methods, data recording, etc., can solve the problems of inability to realize media, inability to ensure the stability of amorphous phases, and drop in crystallization temperature, and achieve excellent recording. The effect of excellent preservation and record preservation, and high erasing performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment approach 1
[0047] As Embodiment 1 of the present invention, an example of an optical information recording medium in which information is recorded and reproduced using laser light will be described. figure 1 A partial cross section of the information recording medium is shown.
[0048] Such as figure 1 The information recording medium 100 shown has the following structure, that is: a reflective layer 106 is formed on the surface of one side of the substrate 107, a dielectric layer 105 is formed on the surface of the reflective layer 106, and a dielectric layer 105 is formed on the surface of the dielectric layer 105. For the recording layer 104 , the interface layer 103 is formed on the surface of the recording layer 104 , the dielectric layer 102 is formed on the surface of the interface layer 103 , and the cover layer 101 is further formed. Here, the recording layer 104 includes structural layers from the first to the Mth, and starting from the side of the dielectric layer 125, the Mt...
Embodiment approach 2
[0161] An example of an information recording medium will be described as Embodiment 2 of the present invention. figure 2 A partial cross section of the information recording medium is shown.
[0162] figure 2 The information recording medium 200 shown has a structure in which a substrate 214, an intermediate layer 208, a first information layer 240, and a cover layer 201 are arranged in this order. in order to be with figure 2 The medium 204 having the structure shown in the figure distinguishes two information layers and the recording layers contained therein, and the layer closer to the incident light is called "first", and the layer farther away is called "second".
[0163] More specifically, the second information layer 250 is formed by sequentially disposing a reflective layer 213 , a dielectric layer 212 , a second recording layer 211 , an interface layer 210 , and a dielectric layer 209 on one surface of a substrate 214 . Among them, the second recording layer 21...
Embodiment approach 3
[0218] An example of an information recording medium will be described as Embodiment 3 of the present invention. image 3 A partial cross section of the information recording medium is shown.
[0219] image 3 The shown information recording medium 300 has: a dielectric layer 302 is formed on one surface of a substrate 301, an interface layer 303 is formed on the surface of the dielectric layer 302, a recording layer 304 is formed on the surface of the interface layer 303, and An interface layer 305 is formed on the surface of the recording layer 304, a dielectric layer 306 is formed on the surface of the interface layer 305, a light absorption correction layer 307 is formed on the surface of the dielectric layer 306, and a light absorption correction layer 307 is formed on the surface of the light absorption correction layer 307. A reflective layer 308 is provided, and a dummy substrate 310 is bonded via an adhesive layer 309 . The recording layer 304 includes the first to ...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com