Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices

A technology for surface mounting and electronic devices, which is applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, etc., and can solve problems such as the difficulty of laser beams reaching welding positions

Inactive Publication Date: 2008-08-27
SHEEX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, it is still extremely difficult to get the laser beam to the welding position

Method used

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  • Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices
  • Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices
  • Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices

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Embodiment Construction

[0048] The embodiments of the present invention are described below in conjunction with the drawings.

[0049] Figure 5 It is a cross-sectional view of an important part of the surface mount circuit board according to the first embodiment of the present invention.

[0050] The surface mount circuit board according to the first embodiment includes an insulating substrate 1 having a plurality of through holes. Each through hole is located at a position where a pad is to be formed, and extends from the front surface to the back surface of the insulating substrate 1. In addition, each through hole is provided with a copper plating layer 11 covering the entire inner wall of the through hole and also covering part of the front and rear surfaces of the insulating substrate 1 around the peripheral edge of the through hole. Each through hole covered with the copper plating layer 11 (part 11a) is filled with a high thermal conductivity epoxy resin 12, which is obtained by mixing copper po...

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PUM

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Abstract

A surface mount circuit board includes: an insulating substrate having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members each filing a different one of the though holes; lands each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.

Description

Technical field [0001] The present invention relates to a surface-mounted circuit board for mounting surface-mounted electronic devices thereon, a method for manufacturing a surface-mounted circuit board, and a method for mounting surface-mounted electronic devices. Background technique [0002] In recent years, the development of resin molding technology has brought about the miniaturization of electronic devices. Relying on this development and the rapid development of surface mounting technology, a complex circuit composed of various electronic devices mounted on a single circuit board has been provided. [0003] What is particularly prominent among these developments is the introduction of electronic devices with external leads, which enable the electronic devices to be directly mounted on the surface of the circuit board on which the wiring is formed. It was found that the significant difference between mounting surface-mounted electronic devices and mounting pin-mounted ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/34
Inventor 松岛义彦
Owner SHEEX
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