Re-melting interconnection approach for high-frequency electromagnetic radiation solder micro-boss

Abstract

The invention discloses a method for packaging, assembling and interconnecting electronic devices - a method for remelting and interconnecting micro-protrusion platforms of high-frequency electromagnetic radiation solder. It is achieved through the following steps, (1) pre-preparing solder and flux on the surface of the interconnection pad of the electronic device; (2) using high-frequency electromagnetic radiation on the solder at the interconnection pad of the electronic device, The brazing material at the interconnection pad is self-heated and melted under the action of high-frequency electromagnetic radiation and wetted on the surface of the interconnection pad; (3) stop the high-frequency electromagnetic radiation, and the solder is on the surface of the interconnection pad of the electronic device Cool and form the solder boss; (4) align the interconnection pads of the electronic devices forming the solder bumps with the pads on the printed circuit board and mount them; (5) use high-frequency electromagnetic radiation at the solder pads The solder boss, the solder boss melts by self-heating, and wets between the interconnection pad of the electronic device and the pad surface of the printed circuit board; (6) stop high-frequency electromagnetic radiation, and naturally form an interconnection solder after cooling point. The invention has the advantages of reliable operation, novel method and great popularization value.

Description

technical field [0001] The invention relates to a method for packaging, assembling and interconnecting electronic devices. Background technique [0002] Electronic packaging devices are increasingly developing in the direction of high density, and devices such as ball grid array packaging (BGA: Ball Grid Assembly), chip scale packaging (CSP: Chip Scale Packaging), and silicon wafer multilayer three-dimensional packaging have emerged. At present, the interconnection of these high-density packaging devices is mainly adopted: (1) hot air reflow soldering process; (2) infrared reflow soldering process; (3) gas phase reflow soldering process; (4) laser reflow soldering process. The first three processes are all heat conduction heating interconnection methods for the entire electronic packaging device, so the electronic chip is seriously affected by heat and is not suitable for interconnection of heat-sensitive devices. On the other hand, due to uneven heat conduction and long he...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the defects that the electronic chip is seriously affected by heat and the implicit joint cannot be locally heated by the packaging method of the prior art, a remelting interconnection method for e