Non-preplating type non-cyanide silver-plating electroplate liquid
A cyanide-free silver plating and electroplating solution technology, which is applied in the field of electrochemical silver plating, can solve problems such as high cost of plating solution, problems of stability of plating solution, and contamination of plating solution, and achieve bright coating adhesion, good coating adhesion, Good stability of plating solution
Inactive Publication Date: 2010-08-11
FUZHOU UNIV
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Problems solved by technology
Compared with cyanide silver plating, there are still many shortcomings in cyanide-free silver plating. The main problems are: (1) The stability of the plating solution
The stability of many cyanide-free silver plating solutions is not good, whether it is an alkaline plating solution, an acidic plating solution or a neutral plating solution, there are problems with the stability of the plating solution to varying degrees, which brings inconvenience to management and operation, and also reduces the cost. increased by
(2) The cost of plating solution is higher
It not only seriously affects the bonding force between the silver plating layer and the substrate, but also the iron and copper ions generated during the replacement process will pollute the plating solution
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Abstract
The invention provides non-preplating type cyanide-free silver-plating plating solution, which is characterized in that: the mass concentration of various compositions of the raw material dispensation of the plating solution is as follows: silver ion source materials of 1 to 200 grams per liter; coordination agent creatinine and creatinine derivatives of 1 to 800 grams per liter; supporting electrolytes of 1 to 200 grams per liter; plating solution pH regulators of 0 to 550 grams per liter; and the residual is an electroplating additive system. Compared with the prior cyanide-contained silverplating technological formula, the cyanide-free silver-plating plating solution is low in toxicity or nontoxic and has good stability; simultaneously, the displacement speed of silver ions, monometals such as copper, nickel, ferrum, aluminum, chromium, titanium and so on and alloy substrates in the plating solution is very slow; plating parts are not required to be preplated or immersed and a cladding has good binding force and is bright, thereby the application requirements in multiple fields such as decorative electroplating, functional electroplating and so on are met.
Description
technical field The invention belongs to the technical field of electrochemical silver plating, and in particular relates to a cyanide-free silver plating solution without preplating. Background technique The silver-plated layer has high conductivity, light reflection ability, high chemical stability to organic acids and alkalis, and its price is cheaper than other precious metals. It has been widely used in decorations, tableware and electronic products and other fields. So far, most of the domestic and foreign electroplating silver processes still adopt the cyanide silver plating process to electroplate the silver layer, mainly due to the good stability of the plating solution, good plating ability and depth capability, fine crystallization of the coating, and silvery white appearance. However, cyanide is highly toxic and extremely harmful to the human body and the environment. Good exhaust equipment and wastewater treatment conditions are required during production. Howe...
Claims
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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/46
Inventor 孙建军向统领谢步高林志彬陈国南
Owner FUZHOU UNIV
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