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Resin sealing method, mold for resin sealing, and resin sealing apparatus

A resin sealing and resin technology, applied in the field of mold and resin sealing equipment, resin sealing mold and resin sealing equipment, to achieve the effect of simplifying structure, reducing cycle time and improving production efficiency

Inactive Publication Date: 2012-07-18
FUJITSU MICROELECTRONICS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the method described in Japanese Patent Laid-Open No. 11-340263 cannot be applied to resin-sealing both surfaces of sheet members, such as semiconductors such as QFP (Quad Flat Package) or SOP (Small Outline Package). Encapsulation is resin-sealed

Method used

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  • Resin sealing method, mold for resin sealing, and resin sealing apparatus
  • Resin sealing method, mold for resin sealing, and resin sealing apparatus
  • Resin sealing method, mold for resin sealing, and resin sealing apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0052] figure 1 is a schematic cross-sectional view of a resin sealing mold provided in a resin sealing apparatus used in a resin sealing method of an electronic component according to a first embodiment of the present invention. figure 1 That is to refer to the following Figure 2 to Figure 5 Cross-sectional view of line X-X in.

[0053] refer to figure 1 , The resin sealing mold of the first embodiment of the present invention includes an upper mold 1 , a lower mold 2 , a first middle mold 3 and a second middle mold 4 . The respective areas of the upper mold 1 , the lower mold 2 , the first middle mold 3 and the second middle mold 4 are substantially the same.

[0054] The upper mold 1 is fixed to an upper mold fixing portion 5 of the resin sealing apparatus. The lower mold 2 is fixed to a lower mold fixing portion 6 of the resin sealing apparatus. The first intermediate mold 3 is stacked on the lower mold 2 . The second intermediate mold 4 is stacked on the first inte...

no. 2 example

[0115] In the first embodiment of the present invention, the pot portion 18 (which is a single resin supply source) is provided in the lower mold 2 and the intermediate molds 3, 4 where the cavity forming portions 7 to 9 are formed. Resin is supplied from the pot-shaped portion 18 to the cavity forming portions 7 to 9 via the lower-mold runner portion 28 , the first middle-mold runner portion 25 , and the second middle-mold runner portion 22 , wherein the lower-mold runner portion The portion 28 , the first middle mold runner portion 25 , and the second middle mold runner portion 22 are resin passages communicating with the cavity forming portions 7 to 9 .

[0116] But the present invention is not limited to this example. The present invention is applicable to an example in which molten resin is independently supplied to each cavity forming portion of a stack mold.

[0117] Figure 13 is a first schematic cross-sectional view of a resin sealing mold provided in a resin seali...

no. 3 example

[0156] In the first and second embodiments of the present invention, the cavity forming portions 7 and 67 are formed in the lower molds 2 and 62 other than the first intermediate molds 3 and 63 and the second intermediate molds 4 and 64 . But the present invention is not limited to these examples. The present invention can be applied to a case where the cavity forming portion is not formed in the upper mold and the lower mold but formed only on the upper and lower surfaces of the intermediate mold sandwiched between the upper mold and the lower mold.

[0157] Figure 21 is a schematic cross-sectional view of a resin sealing mold provided in a resin sealing apparatus used in a resin sealing method of an electronic component according to a third embodiment of the present invention. Figure 22 for Figure 21 A plan view of the intermediate mold 103 is shown. Figure 21 is along Figure 20 Cross-sectional view of line X-X in.

[0158] Figure 21 , Figure 22 in, with Figu...

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Abstract

The invention discloses a resin sealing method, a resin sealing mode and a resin sealing device. The resin sealing method includes the steps of providing an intermediate mold between an upper mold and a lower mold, the intermediate mold having a cavity forming part where a resin sealed part is received; and introducing sealing resin into the cavity forming part of the intermediate mold and another main surface of the intermediate mold via a runner, the runner being provided in a vicinity of the cavity forming part of the intermediate mold and piercing the intermediate mold in a thickness direction. The invention can seal the stacked pluralities of wirings in simultaneous and disposable way; thereby the invention can enhance the production rate of the resin sealing step without increasing the manufacturing cost. In addition the invention can simplify the structure of the resin sealing device to reduce the manufacturing cost. Moreover, the invention can reduce the periodic time while continuously processing the entire sealing operation.

Description

technical field [0001] The present invention generally relates to a resin sealing method, a resin sealing mold, and a resin sealing apparatus. More specifically, the present invention relates to a resin sealing method of an electronic part, and a mold and resin sealing apparatus used for the resin sealing method, in which a sheet member (such as a lead frame or wiring) mounted with an electronic part (such as a semiconductor element) is plate) at least one surface is sealed with molten resin. Background technique [0002] Generally, a resin sealing method is used as one of sealing methods for sealing a semiconductor element (electronic part) mounted on a sheet member such as a lead frame or a wiring board to form a semiconductor device. A so-called transfer mold method is used as the resin sealing method. [0003] In the transfer molding method, a sheet member such as a wiring board or a lead frame is sandwiched between an upper mold and a lower mold. In a cavity forming ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
CPCH01L24/97H01L2224/97H01L2224/32245H01L2224/48247B29C45/02H01L2224/48227B29C45/2708H01L2924/15311B29C45/14655B29C45/40B29C45/322H01L2224/48091H01L2224/73265H01L2224/49171H01L2224/32225H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012H01L21/56H01L23/28
Inventor 西村隆雄小酒井一成
Owner FUJITSU MICROELECTRONICS LTD
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