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Inductor encapsulation member

A technology of induction device and package, applied in electrical components, electric solid-state devices, semiconductor devices, etc., can solve problems such as rising cost and complex process

Inactive Publication Date: 2008-09-24
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, no matter whether the static electricity is conducted by means of IC layout or by making solder balls, multiple and complicated semiconductor manufacturing processes are required, which leads to an increase in cost and a more complicated manufacturing process.

Method used

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Embodiment Construction

[0031] The invention provides an induction device package for conducting static electricity. The sensing device package includes a substrate, a sensing chip and a conductive strip. The sensing chip is electrically connected with the substrate. The conductive strip is adjacent to the sensor chip and electrically connected with the substrate. When an object to be sensed approaches the sensing chip, the static electricity on the object to be sensed is conducted to the ground terminal through the conductive strip, so as to prevent the instantaneous large current from damaging the sensing chip and other circuits. The following is a preferred embodiment for detailed description, but this embodiment is only one of several implementations under the inventive spirit of the present invention, and the words and icons in its description will not limit the intended protection scope of the present invention shrink.

[0032] Please refer to figure 1 , which shows a top view of the sensin...

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Abstract

A packaging part of an induction device comprises a baseplate, an induction chip and a first bus bar. The induction chip is connected with the baseplate electrically. The first bus bar is adjacent to the induction chip and is connected with the baseplate electrically.

Description

technical field [0001] The present invention relates to an induction device package, and in particular to an induction device package conducting static electricity. Background technique [0002] Electrostatic Discharge (ESD) forms a large current in a short period of time, and may generate a current of several amperes within a few nanoseconds (ns), thus easily causing permanent damage to the integrated circuit chip. Therefore, appropriate protection devices are required to provide a discharge path to protect the chip. [0003] Sensing device packages are widely used in many electronic devices, such as fingerprint readers on notebook computers. The induction device package often generates static electricity due to the user's touch or friction with other objects. If the static electricity accumulates too much and the voltage rises to generate electrostatic discharge, the chip and circuit damage mentioned above will occur. [0004] In the current technology, most methods of e...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L23/60H05F3/02G06K9/00
CPCH01L2924/15311H01L2224/48091H01L2924/0002H01L2924/1815H01L2224/48227H01L2224/45144
Inventor 卢勇利
Owner ADVANCED SEMICON ENG INC