Contact and electrical connector

Abstract

Provided are a contact, which improves contact reliability of a contact section of a first elastic contact arm which makes contact with a conductive pad of an IC package and reliability of a contact section of a second elastic contact arm which makes contact with a conductive pad of a circuit board, and an electrical connector. The contacts (30, 40) of the electrical connector (1) are provided with substantially rectangular substrate sections (31, 41), which are fixed in contact storing cavities (16, 17) of a housing (10) and extend in the vertical direction; connecting pieces (32, 42), which extend in a direction orthogonally intersecting main planes of the substrate sections (31, 41) from the substrate sections (31, 41); the first elastic contact arms (34, 44), which extend diagonally upward from leading ends of the connecting pieces (32, 42) and have contact sections (34c, 44c) making contact with the conductive pad of an IC package (PKG); and the second elastic contact arms (35, 45), which diagonally extend downward from leading ends of the connecting pieces (32, 42) and have contact sections (35c, 45c) making contact with the conductive pad of the circuit board (PCB).

Description

technical field [0001] The present invention relates to a contact and an electrical connector for electrically connecting an IC package on which an IC such as a DMD (Digital micromirrodevice: digital micromirror device) is mounted, to a circuit board. Background technique [0002] Conventionally, as an electrical connector for electrically connecting an IC package to a circuit board, for example, known Figure 15 and Figure 16 The device shown (refer to Patent Document 1). Figure 15 is a perspective view showing electrical connectors together with IC components, Figure 16 is along Figure 15 Sectional drawing of line 16-16. [0003] exist Figure 15 and Figure 16 Among them, the electrical connector 101 includes an insulating housing 110 and a plurality of contacts 120 mounted on the housing 110 . [0004] The case 110 includes a substantially rectangular plate-shaped base portion 111 mounted on a circuit board 140 , and a side wall 112 constituted by four sides risin...

AI Technical Summary

Problems solved by technology

[0013] That is, for some reason, the IC package 130 and the circuit board 140 may be either bent or deformed.

In this case, when the conductive pad provided on the IC package 130 is brought into contact with and pressed to the contact portion 122c, and the conductive pad provided on the circuit board 140 is brought into contact with and pressed to the contact portion 123c, the first elasticity of the contact 120 cannot be obtained. The desired amount of bending of the contact arm 122 and the second elastic contact arm 123 in the up-down direction, accordingly, the desired elastic force of the first elastic contact arm 122 and the second elastic contact arm 123 cannot be obtained, and the contact cannot be made. Appropriate contact pressure is applied to the contact portion 122c and an appropriate contact pressure is applied to the contact portion 123c, and further, the contact reliability of these contact portions 122c, 123c may be insufficient.

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