Communication machine box

Abstract

The invention relates to a communication machine case which comprises a back plate and the outer shell of the machine case, which is arranged outside the back plate. The communication machine case of the invention also comprises a fan disk which is embedded in the outer shell of the machine case and adjacent and parallel to the wall surface of the back plate, blowholes which are arranged on the back plate and non-symmetrically arranged while being bounded by the axle wire of the back plate, and air inlets which are arranged on the outer shell of the machine case and adjacent to the back plate while the side wall of the air inlet is away from one side provided intensively with the blowholes. According to the technical proposal, the invention adopts a technical means that the fan disk is arranged at the rear surface of the communication machine case and the air inlets and the blowholes are correspondingly arranged on the side wall of the outer shell of the machine case and the back plate, thus avoiding the limitation caused by the arrangement position of the fan disk on the improvement of the integration level of the communication machine case, and being capable of improving the cooling efficiency so as to provide the effective protection for the improvement of the integration level of the communication machine case in the event of the power consumption increase caused by the improvement of the integration level.

Description

technical field [0001] The invention relates to a communication box, in particular to a communication box for accommodating electrical and communication equipment and having a heat dissipation function. Background technique [0002] In the prior art, due to the continuous improvement of the system functions of the communication equipment, the requirements for the integration degree of the system are also continuously increased. In order to improve integration, most high-end communication equipment adopts a modular cabinet-type chassis to house communication modules, such as line card modules. [0003] The heat dissipation of this kind of communication chassis is a problem that has attracted much attention at present. The design difficulty of the heat dissipation structure mainly comes from two aspects: one is that the high-power devices are compressed in a small space due to space constraints, which makes the heat dissipation of the system more difficult. The problem is bec...

AI Technical Summary

Problems solved by technology

The air volume of the fan is positively correlated with its thickness, so reducing the thickness of the fan will greatly affect the heat dissipation performance

It can be seen that in this structural design, the increase in heat dissipation capacity and port density is a pair of contradictions, and it cannot be balanced

When the function upgrade of a single communication module leads to an increase in power consumption, the overall heat dissipation of the communication chassis becomes an important issue

The heat dissipation structure of the vertical plug-in communication chassis is similar to that of the horizontal plug-in communication chassis, and there are the same problems

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