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Circuit board with internally embedded conductive wire and manufacturing method therefor

A technology for circuit boards and substrates, which is used in printed circuit manufacturing, semiconductor/solid-state device manufacturing, circuits, etc. It can solve problems such as inability to test electrical properties, and achieve the effect of increasing gaps and avoiding holes.

Active Publication Date: 2011-07-27
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the structures 124 are electrically connected to each other, they cannot be electrically tested when they leave the factory.
[0006] In addition, since the formed pads 122 are flush with the surface 132 of the substrate 130 and the solder resist layer 190 generally has a considerable thickness, when the chip is electrically connected to the pads 122 by solder balls, the solder balls will Only part of the height exposes the solder resist layer 190 (not shown), which will make the gap (Die Gap) between the chip and the substrate 130 too small, so that the underfill or the molding compound (Molding compound) ) is not easy to fill the gap between the chip and the substrate 130, thus causing the generation of voids

Method used

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  • Circuit board with internally embedded conductive wire and manufacturing method therefor
  • Circuit board with internally embedded conductive wire and manufacturing method therefor
  • Circuit board with internally embedded conductive wire and manufacturing method therefor

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Embodiment Construction

[0018] refer to Figure 2a to Figure 2g The method for manufacturing a circuit board with embedded conductive circuits according to the first embodiment of the present invention is to form a metal layer 220 on a carrier board 210, such as a copper layer, and the second surface 223 of the copper layer 220 is pasted Attached to the carrier 210, the first surface 221 opposite to the second surface 223 has protruding structures 222 and 224. The patterns of these protruding structures 222 and 224 are consistent with the pattern of the conductive circuit to be formed on the substrate. Corresponding (see Figure 2a and Figure 2b ). Then, the carrier 210 is bonded to a soft substrate, such as a B-stage BT (BismaleimideTriazine) substrate 230 , so that the protrusion structures 222 and 224 on the copper layer 220 are embedded in a surface 232 of the substrate 230 . The other surface 234 of the substrate 230 can also be laminated with another metal layer 240 having a protruding stru...

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Abstract

The invention provides a method for making a circuit board with a buried type conductive circuit. The method is to form a buried conductive circuit layer on the surface of a plaque and increase the height of a welded pad and a finger, thereby bringing convenience to the following glue-feed processing.

Description

technical field [0001] The present invention relates to a circuit board and its manufacturing method, more particularly to a circuit board with embedded conductive lines and its manufacturing method. Background technique [0002] In recent years, as electronic components have become multifunctional and smaller, the technology of packaging substrates has also developed rapidly in order to achieve light, thin, short, small and highly dense circuit patterns. In particular, such light, thin, short, small and highly dense wiring patterns are required to be used in chip scale package (CSP) product groups. In order to form dense circuit patterns on a small-sized substrate, embedded conductive circuits are generally formed on the substrate by pressing. [0003] refer to Figure 1a to Figure 1h , the existing manufacturing method for forming embedded conductive circuits on a substrate is to form a copper layer 120 on a carrier board 110 first, and the copper layer 120 has protruding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/498H05K3/00H05K3/06H05K3/28H05K1/02
CPCH01L2924/0002
Inventor 廖国成
Owner ADVANCED SEMICON ENG INC