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Heating device

A technology for heating devices and heaters, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc. It can solve the problem of unsatisfactory space saving in the height direction, and achieve excellent environmental protection, space reduction, and uniform temperature distribution.

Active Publication Date: 2008-10-29
USHIO DENKI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Considering the following problem: a U-shaped lamp is composed of a horizontal part and a pair of vertical parts, and only the horizontal part with the filament inside contributes to light emission.
[0019] In addition, in recent years, this kind of heat treatment device has a tendency to make the space (mainly in the height direction) for setting the lamp assembly extremely small, so when using U-shaped lamps require space corresponding to the vertical part of the lamp, so it is not ideal from the viewpoint of saving space in the height direction

Method used

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Embodiment Construction

[0039] Below, use figure 1 and figure 2 A structural example of the heating device of the present invention will be described. figure 1 It is a front cross-sectional view showing a structural example of the heating device of the present invention; figure 2 yes means figure 1 It is a top view of an arrangement example of heaters 1 of the first lamp assembly 10 and the second lamp assembly 20 shown.

[0040] Such as figure 1 As shown, the heating device 100 includes a first lamp assembly 10, a second lamp assembly 20, a reflector 2, a first lamp fixing stand (not shown), a second lamp fixing stand 3, and a quartz window 4. The light emitted from the first lamp unit 10 and the second lamp unit 20 is directly or reflected by the reflector 2 and irradiates the processed object 6 fixed on the fixed table to heat the processed object 6 .

[0041] The reflector 2 is formed, for example, by plating gold on a base material made of oxygen-free copper, is placed above the secon...

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Abstract

A heating device in which uniform heating of an article to be processed is possible even in the case a temperature change which leads to a loss of the uniformity of the temperature distribution in a narrowly delineated area, and in which a reduction in the size of the device is possible. The heating device has a plurality of heaters, each heater having a single bulb of transparent material in which there is a filament that is divided in the axial direction into several filament parts and the respective filament parts are supplied with power independently of each other.

Description

[0001] The patent application of the present invention is a divisional application with the filing date of March 2, 2006, the application number of 200610059456.0, and the title of the invention as "heater and heating device equipped with heater". technical field [0002] The present invention relates to a heater and a heating device equipped with the heater, and in particular, to a heater for irradiating emitted light to an object to be processed for the purpose of heating an object to be processed, and a heating device equipped with the heater. device. Background technique [0003] In general, in semiconductor manufacturing processes, heat treatment is used in various processes such as film formation, oxidation diffusion, impurity diffusion, nitridation, film stabilization, silicide, crystallization, and ion implantation activation. In order to improve the yield and quality of the semiconductor manufacturing process, rapid thermal processing (RTP: Rapid Thermal Processing)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
Inventor 水川洋一金津桂太吉冈正树铃木信二关匡平
Owner USHIO DENKI KK