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Light emitting device and manufacturing method thereof

A technology for light emitting devices and emitting elements, applied in the direction of electric solid devices, semiconductor devices, electrical components, etc., can solve problems such as failures or other adverse events that cannot be ignored, and achieve the effects of easy wiring, efficient divergence, and easy manufacturing.

Inactive Publication Date: 2008-11-05
NEC LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the possibility of breakage or other adverse events in the part cannot be ignored

Method used

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  • Light emitting device and manufacturing method thereof
  • Light emitting device and manufacturing method thereof
  • Light emitting device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. image 3 is a top view showing the light-emitting device of this embodiment, and Figure 4 is a cross-sectional view showing a state where the light-emitting device of this embodiment is mounted on a target device.

[0031] like image 3 and 4 As shown, the resin mold 32 is placed on the flat substrate 21 . For example, a substrate created by forming an insulator on the surface of a metal base is used as the flat substrate 21 . The resin mold 32 has a void portion (cavity 17 ), whereby the area on the side in contact with the flat substrate 21 decreases and the area on the opposite side to the flat substrate 21 increases. The resin mold 32 includes a lead frame mounted using insert molding or other methods. In the manner described above, the lead frame component configured by the integrated lead frame and resin mold 32 is fastened to the flat substrat...

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Abstract

An LED chip is mounted on a submount, and submount electrodes are formed to constitute a submount member. A light-emitting unit is configured by mounting the submount member on a flat substrate. A lead frame member having a lead frame electrode is configured using a lead frame and a resin mold. A light-emitting device is obtained by overlapping the light-emitting unit and the lead frame member, so that the electrodes contact each other. There is accordingly obtained a light-emitting device that is highly reliable with respect to vibration, shock, and other external forces; that efficiently dissipates generated heat; and that is readily fabricated; and a method for fabricating same.

Description

technical field [0001] The present invention relates to a light-emitting device and a manufacturing method thereof, in particular, to a light-emitting device with a cavity structure and a manufacturing method thereof. Background technique [0002] Existing light-emitting devices generally have a cavity structure formed in such a shape that the inner diameter of the cavity increases from the aperture toward the substrate. figure 1 is a top view showing a conventional light emitting device. figure 2 is its cross-sectional view. like figure 1 and 2 As shown in , an LED (Light Emitting Diode) chip 11 mounted on a submount 12 is placed on the base of a cavity 17 formed in a resin mold 32 . The submount electrode pair 14 a , 14 b is also arranged together with the LED chip 11 on the submount 12 . The base electrodes 14a, 14b are electrically connected to the electrodes of the LED chip 11 through bonding wires 13a, 13b, respectively. The bonding wires 13a, 13b are electrical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/62H01L33/64
CPCH01L25/0753H01L33/483H01L33/62H01L2224/48091H01L2924/19107H01L2924/01322H01L33/486H01L33/644Y10T29/49117H01L2924/00014H01L2924/00
Inventor 冲村克行
Owner NEC LIGHTING