Dimmable double-color integrated circuit light source packaged by CSP (Chip Scale Package)

Abstract

The invention relates to a CSP (Chip Scale Package) dimmable double-color integrated circuit light source. The CSP dimmable double-color integrated circuit light source comprises a heat conduction substrate and a copper foil which are extruded and bonded through an insulating bonding layer, etching a signal circuit on the surface of the copper foil and coating reflective ink; and removing the reflective ink on the surface of the preset welding point on the signal line and spraying tin to form a bonding pad for welding the flip light source chip. One ends of any two signal lines on the same heat conduction substrate are connected with the same positive electrode pin, and the other ends are connected with different negative electrode pins. And the inverted light source chips on the same signal line have the same color temperature. Therefore, the metal substrate with a high heat dissipation coefficient can rapidly conduct heat generated by operation of the flip light source chip, the metal substrate can be attached to and connected with heat dissipation equipment to efficiently dissipate the heat, safe and stable operation is ensured, and the service life is prolonged. In addition, the flip light source chips with different color temperatures on different signal lines are independently controlled, so that double-color dimming can be realized, fluorescent powder does not need to be laid for multiple times, the color temperature is accurate, and the light-emitting brightness is improved through reflection of the reflective ink.

Description

technical field [0001] The invention relates to the technical field of CSP package and integrated light source, in particular to a CSP packaged dimmable two-color integrated line light source. Background technique [0002] CSP packaging technology is widely used in the production of electronic equipment, chips and other products. It has the advantages of low production design cost, compact structure, small weight and volume, etc. It can be mass-produced and conveniently selected based on the installation environment. In the field of lighting Get lots of applications. [0003] In the field of lighting, the application of CSP LED chips occupies the vast majority. Because its function is lighting, there is a significant problem of heat generation during operation. And produce equipment damage, even safety accidents. [0004] In addition, traditional CSP LED chips are laid with phosphors in order to enhance the luminous effect or adjust the color temperature. However, when pro...

AI Technical Summary

Problems solved by technology

[0003] In the field of lighting, the application of CSP LED chips occupies the vast majority. Because its function is lighting, there is a significant problem of heat generation during operation. resulting in equipment damage, or even safety accidents

[0004] In addition, traditional CSP LED chips are laid with phosphor powder in order to enhance the luminous effect or adjust the color temperature. When producing two-color CSP LED chips, phosphor powder laying needs to be carried out twice, and the production process is complicated.

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