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Substrate carrying mechanism and substrate treating device having the same

A substrate and mounting surface technology, applied in the direction of electric heating devices, gaseous chemical plating, heating elements, etc., can solve the problems of inability to improve temperature uniformity, and achieve the effect of improving temperature uniformity

Inactive Publication Date: 2011-08-03
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the temperature of the central part of the heater is generally higher than that of the peripheral part, the temperature uniformity cannot be improved to a certain extent.

Method used

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  • Substrate carrying mechanism and substrate treating device having the same
  • Substrate carrying mechanism and substrate treating device having the same
  • Substrate carrying mechanism and substrate treating device having the same

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Embodiment Construction

[0028] Hereinafter, one embodiment of the present invention will be specifically described with reference to the drawings.

[0029] figure 1 It is a cross-sectional view showing a basic structure of a substrate mounting mechanism according to an embodiment of the present invention.

[0030] A substrate loading mechanism according to one embodiment is provided, for example, in a processing container of a substrate processing apparatus such as a film forming apparatus or an etching apparatus, and a substrate to be processed such as a semiconductor wafer is placed in the processing container, and the substrate to be processed is heated. the heating element.

[0031] Such as figure 1 As shown, the substrate mounting mechanism 100 includes a quartz heater body 101 in which a heating element 102 is embedded, and a corrosion-resistant ceramic member 104 mounted on a substrate mounting surface 103 of the quartz heater body 101 .

[0032] The heater main body 101 made of quartz, alt...

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Abstract

The invention provides a substrate placing apparatus capable of further improving temperature uniformity, including a quartz heater main body(101) burying a heating unit(102), and a corrosion-resistant ceramic part that is placed on the treated substrate placing surface(103) of the quartz heater main body(101).

Description

technical field [0001] The present invention relates to a substrate mounting mechanism having a heating element for mounting and heating a substrate such as a semiconductor wafer in a processing container in a substrate processing apparatus such as a film forming apparatus, and to a substrate processing apparatus including the substrate mounting mechanism. Background technique [0002] In the manufacture of semiconductor equipment, there is a process of implementing vacuum treatment such as CVD film formation treatment or plasma etching treatment on the semiconductor wafer as the substrate to be processed. However, the semiconductor wafer as the substrate to be processed needs to be Since the wafer is heated to a predetermined temperature, the semiconductor wafer is heated using a heater that also serves as a substrate mounting table. [0003] As such a heater, a stainless steel heater or the like can be used in the prior art, and in recent years, ceramic heaters that are le...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/44H05B3/20H01L21/31
CPCH01L21/324H01L21/67H01L21/67103H01L21/683H05B1/0233H05B3/06H05B3/12H05B3/145H05B3/20H05B3/283
Inventor 田中澄小松智仁川崎裕雄
Owner TOKYO ELECTRON LTD