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Enhanced substrate using metamaterials

A metamaterial and substrate technology, applied in waveguide devices, reduction of crosstalk/noise/electromagnetic interference (, waveguide, etc.

Inactive Publication Date: 2008-12-24
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] When embedding higher performance and more functionality into IC devices, sending signals inside the IC and to other components on the periphery of the IC becomes a challenge

Method used

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  • Enhanced substrate using metamaterials

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Embodiment Construction

[0045] While the invention can be changed into various modifications and alternative forms, the features thereof have been shown by way of example in the drawings and will be described in detail below. However, the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and substitutions falling within the spirit and scope of the present invention.

[0046] The present invention is effective for reducing noise associated with signal reflections at impedance boundaries. This noise can be minimized through the use of metamaterials. A metamaterial according to the invention is an arrangement of conductors in an insulating layer to reduce the resonance response of a line when a signal propagates through it.

[0047] In an example embodiment, there is a rectangular-like shape of the open plane of the conductive material and an arrangement of the linear length of the conductor to ma...

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Abstract

In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different from the real permittivity and permeability of the insulator used. In an example embodiment, a substrate (10) is configured as a meta-material. The meta-material provides noise protection for a signal line (15) having a pre-determined length disposed on the meta-material. A conductive material (30) is arranged into pre-determined shapes (35) having a collective length. Dielectric material envelops the conductive material and the conductive material is disposed at a first predetermined distance (55) from the topside surface and at a second predetermined distance from the underside surface. The collective length of the conductive material (30) is comparable to the pre-determined length of the signal line (15).

Description

technical field [0001] The present invention relates to integrated circuit (IC) packaging. More particularly the present invention relates to the use of meta-materials in packaging substrates to reduce noise that may be present on signal lines. Background technique [0002] The electronics industry continues to rely on advances in semiconductor technology to enable higher function devices on more compact areas. For many applications to achieve higher functional devices, it is required to integrate a large number of electronic devices in a single silicon wafer. As the number of electronic devices per given area of ​​a silicon wafer increases, the fabrication process becomes more difficult. [0003] Various semiconductor devices are fabricated with various rules for various applications. Such silicon-based semiconductor devices typically include metal-oxide-semiconductor field-effect transistors (MOSFETs), such as p-channel MOS (PMOS), n-channel MOS (NMOS) and complementary...

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Application Information

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IPC IPC(8): H01L23/66H01Q15/00H01P3/08H05K1/02
CPCH01L23/64H01L2924/19051H01L2924/3011H05K1/0236H01Q15/0086H01L2924/0002H01L2924/00
Inventor 克里斯·怀兰德
Owner TAIWAN SEMICON MFG CO LTD