LED encapsulation having cooling pin and manufacturing method therefor

A technology for light-emitting diodes and a manufacturing method, which is applied in the manufacturing of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., can solve the problems of difficulty in manufacturing, rising manufacturing costs, detachment of heat sinks, etc.

Inactive Publication Date: 2008-12-31
赛米林有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the existing light-emitting diode package with the above structure has the following disadvantages: as the light-emitting operation and the stop operation are repeated, the heat sink may be detached due to the repetition between heat generation and cooling, and in order to dissipate heat The heat sink is forced to be inserted into the substrate, and the size of the mounting part of the heat sink and the substrate needs to be adjusted. Since the reflective hole is integrally formed on the heat sink, it is not easy to manufacture, resulting in an increase in the overall manufacturing cost.

Method used

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  • LED encapsulation having cooling pin and manufacturing method therefor
  • LED encapsulation having cooling pin and manufacturing method therefor
  • LED encapsulation having cooling pin and manufacturing method therefor

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Embodiment Construction

[0023] Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

[0024] exist figure 1 (a) to (c) show the structure of a light emitting diode package according to one embodiment of the present invention.

[0025] First, if figure 1 As shown in (a), the light-emitting diode package according to one embodiment of the present invention consists of a substrate part 100 and a heat dissipation pin 120 that is riveted to one side of the substrate part and protrudes to the other side of the substrate part. constitute.

[0026] The substrate unit 100 may be formed of a printed circuit board or an insulating resin material such as plastic, and is preferably formed of a printed circuit board. In addition, on the above-mentioned base plate part 100, in order to realize the riveting of the heat dissipation pin and it, one end portion for inserting the heat dissipation pin 120 is vertically opened, that is, the insertion part 121 ...

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Abstract

The invention provides a light-emitting diode package with a heat dissipation pin and a manufacturing method thereof, wherein, the light-emitting diode package is provided with a base plate part, on one side of which a light-emitting diode chip is installed and on which a circuit and an insertion hole with a vertical opening are formed, and the heat dissipation pin which is plugged into the insertion hole of the base plate part and riveted with one side of the base plate part and extends and extrudes from the other side of the base plate part, therefore, the heat from the light-emitting diode chip can be effectively dissipated and the heat dissipation pin is easily connected with a circuit base plate.

Description

technical field [0001] The present invention relates to a light emitting diode package (LEDpackage) with a radiating pin and a manufacturing method thereof, more particularly, the present invention relates to a radiating pin capable of effectively dissipating heat emitted from a light emitting diode chip, thereby A light-emitting diode package capable of increasing the integration of light-emitting diode chips relative to the area and a manufacturing method thereof. Background technique [0002] As a semiconductor element that forms the required carrier (electrons or holes) injected by the P-N junction structure and radiates light energy through recombination between them, light-emitting diodes are small and long-lived compared with existing light sources, and due to It converts electrical energy directly into light energy, so its luminous efficiency is high, and it is widely used in display lamps of various electronic devices such as display elements of automotive equipment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L23/36H01L21/50H01L33/64
CPCH01L2924/0002
Inventor 金星列
Owner 赛米林有限公司
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