Thermal management in large area flexible OLED assembly

Abstract

A large area, flexible, OLED assembly has improved thermal management by providing a metal cathode of increased thickness of at least 500 nm. A thermal heat sink trace may be used as alternative or in conjunction with the increased thickness cathode where the trace leads from a central region of the OLED toward a perimeter region, or by other backsheet thermal management designs. External heat sinking, for example to a plate, fixture, etc. may be additionally used or in conjunction with the increased thickness cathode and / or backsheet design to provide further thermal management.

Description

technical field [0001] The present invention relates to a light source, and in particular, to a light source such as a light emitting device including an organic light emitting diode (OLED) panel. More specifically, the present invention relates to thermal management issues associated with large area flexible OLED devices. Background technique [0002] OLED devices are well known in the art and typically include one or more organic light emitting layers disposed between electrodes. For example, the assembly includes a cathode, an organic layer, and a light-transmissive anode formed on a substrate such that the assembly emits light when electrical current is applied to the cathode and anode. Due to the presence of an electric current, electrons are injected into the organic layer from the cathode, and holes may be injected into the organic layer from the anode. The electrons and holes generally pass through the organic layer until they recombine at the light-emitting center...

AI Technical Summary

Problems solved by technology

Thus, there are three areas where thermal management designs must be implemented and must not adversely affect the flexible nature of the device

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