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Ultra-thin QWERTY full keyboard and manufacturing method thereof

A manufacturing method and full keyboard technology, applied to electrical components, electric switches, circuits, etc., can solve problems such as weak rigidity and poor hand feeling, and achieve high production efficiency, good hand feel, and good rigidity

Inactive Publication Date: 2009-01-07
ZTE CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the present invention is to provide an ultra-thin full QWERTY keyboard and its manufacturing method, which overcomes the disadvantages of the ultra-thin smart phone keyboard in the prior art, such as weak rigidity and poor hand feeling caused by key linkage

Method used

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  • Ultra-thin QWERTY full keyboard and manufacturing method thereof
  • Ultra-thin QWERTY full keyboard and manufacturing method thereof
  • Ultra-thin QWERTY full keyboard and manufacturing method thereof

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Embodiment Construction

[0032] In order to further illustrate the technical means and effects of the present invention to achieve the intended purpose, the ultra-thin full QWERTY keyboard proposed by the present invention and its manufacturing method will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0033] figure 1 It is a schematic plan view of the ultra-thin full QWERTY keyboard of the present invention.

[0034] The first embodiment of the present invention is the manufacturing method of described ultra-thin full QWERTY keyboard, comprising the following steps:

[0035] Step 1, manufacturing the UV keycap layer 2 . Under the condition of ultraviolet light, the UV curable adhesive is cured and molded on the first plastic plate 6 through a hot pressing process, thereby forming the entire UV keycap layer 2, which is used to realize various functional keys, specifically including the following processes:

[0036] a. On the first plastic plate 6, the s...

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Abstract

The invention discloses a method for manufacturing an ultrathin QWERTY whole keyboard, which includes the following steps: step one, under the condition of ultraviolet illumination, a UV hardening adhesive is used for solidifying and shaping a UV keycap layer on a first plastic panel by the heat pressing technique; step two, a Rubber layer can be directly formed by a piece of steel strap, a second plastic panel and silica gel by the oil pressing technique; step three, the UV keycap layer and the Rubber layer are stuck and fixed with each other. The method for manufacturing the ultrathin QWERTY whole keyboard of the invention has the advantages of simple technique for assembling the keyboard and high production efficiency. The ultrathin QWERTY whole keyboard of the invention has ultrathin thickness, and the color of the characters and the background are not easy to be worn. No keystroke linkage occurs in the keycap layer, and appearance effect is good. The Rubber layer is good in rigidity, thereby having high evenness of the surface of the keyboard as well as good and uniform hand feeling.

Description

technical field [0001] The invention relates to the field of handheld electronic equipment, in particular to an ultra-thin standard traditional full keyboard and a manufacturing method thereof. Background technique [0002] Mobile phones are developing in the direction of ultra-thin and intelligent, and ultra-thin smart phones will become the mainstream of the mobile phone market. Typically, ultra-thin smartphones have at least one of the following two input methods: handwriting input and keyboard input. Compared with the handwriting input method, the keyboard input method is fast and accurate, and is the best input method for smart phones. Currently, ultra-thin smartphones are generally equipped with a full QWERTY keyboard, which is an ultra-thin standard traditional keyboard. Each key of the ultra-thin full QWERTY keyboard corresponds to a character printed with numbers or letters. Therefore, it is an inevitable trend in the development of subsequent smart phones to be ...

Claims

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Application Information

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IPC IPC(8): H01H13/88H01H13/70H01H13/7057
Inventor 田燕
Owner ZTE CORP
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