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Dispensable cured resin

A resin and compound technology, applied in the field of distributable curable resin, can solve problems such as increasing manufacturing costs

Active Publication Date: 2009-01-21
PARKER HANNIFIN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, using such materials typically involves hand application, or lamination by electronics assemblers, which adds to manufacturing costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention is directed to methods, materials and devices for promoting electromagnetic / radio frequency interference (EMI / RFI) shielding and thermal management in packaged circuits. More specifically, the present invention is directed to a method of packaging integrated circuits with improved thermal management and EMI management; a method of processing a compound used as a thermal interface and / or EMI shield; and a method of EMI shielding and thermal Management equipment. More specifically, the present invention is directed to a method, material and device for facilitating the adjustment of the viscosity of a thermally and / or electrically conductive (or thermally and / or electrically insulating), in-situ, fully cured composite so that the composite can be easily distributed .

[0022] The present invention includes several embodiments that provide for adjustment of the viscosity of a thermally and / or electrically conductive, thermally and / or electrically insulatin...

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PUM

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Abstract

The present invention discloses methods, materials and devices for facilitating electromagnetic / radiofrequency interference (EMI / RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and / or an EMI shield, and an EMI shieldingand thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and / or electrically conductive (or thermally conductive and / or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or / and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre- cured gel component. The process includes applying a shearing force on the compound, thereby rendering the compound dispensable.

Description

[0001] Cross reference of related applications [0002] This application claims the priority rights of U.S. Provisional Application No. 60 / 786,633 filed on March 28, 2006, and the description of the application is incorporated herein by reference. Technical field [0003] The present invention generally relates to methods, materials and devices for improved electromagnetic / radio frequency interference (EMI / RFI) shielding and thermal management in packaged circuits. More specifically, the present invention relates to a method for adjusting the viscosity of a thermally and / or electrically conductive, in-situ formed, fully cured compound used for EMI / RFI shielding and thermal management in a packaged circuit so that the compound can be dispensed , Materials and devices. Background technique [0004] The circuit design of modulator electronic devices (such as televisions, radios, computers, medical instruments, business machines, communication equipment, etc.) has become more and mor...

Claims

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Application Information

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IPC IPC(8): G05D11/00H01L21/00
CPCH05K9/0083H01L2924/0002H01L2924/00C08K7/16C08L83/00G05D11/00H01L21/00
Inventor 迈克尔·H·布尼安菲利普·布拉兹德尔
Owner PARKER HANNIFIN CORP