Method of manufacturing LED lamp
A technology of LED lamps and manufacturing methods, which is applied to the components of lighting devices, semiconductor devices of light-emitting elements, lighting and heating equipment, etc., and can solve the problem of degradation, aging-prone light source and shell interface heat transfer capacity, and performance degradation of LED lamps and other problems, to achieve the effect of superior heat transfer ability
Inactive Publication Date: 2009-02-11
深圳可瑞高新材料股份有限公司
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Problems solved by technology
However, thermosetting or liquid-phase thermally conductive adhesives (greases) are prone to aging during long-term use, resulting in a significant decrease in the heat transfer capability between the light source and the housing interface, resulting in a decline in the performance of LED lamps
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[0019] The present invention will be further described in detail below through specific embodiments and in conjunction with the accompanying drawings.
[0020] A method for manufacturing an LED lamp, comprising the steps of:
[0021] Solderability treatment is performed on the surface to be connected between the LED light source and the casing.
[0022] Place tin-based, copper-based, silver-based brazing materials on the surface after solderability treatment.
[0023] Close the LED light source and the housing, apply a certain pressure and heat to melt the tin-based, copper-based, and silver-based solders in between, and weld the LED light source and the housing together.
[0024] Since the light source and the shell of the LED lamp are connected by welding, the interface between the light source and the shell is tin-based, copper-based, and silver-based solder. The tin-based, copper-based, and silver-based solders have almost no aging problems, so there is no " Thermosettin...
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The invention discloses a manufacturing method of LED lamps, which comprises the following steps: weldable treatment is carried out on the surfaces to be connected of an LED light source and a shell body; a tin-based brazing material, a copper-based brazing material and a silver-based brazing material are put on the surfaces treated by the weldable treatment; the LED light source and the shell body are shut, and a certain pressure is applied and the heating is carried out to melt the tin-based brazing material, the copper-based brazing material and the silver-based brazing material so as to weld the LED light source and the shell body together. As almost no aging problems of the tin-based brazing material, the copper-based brazing material and the silver-based brazing material exist, therefore, the problem that 'the thermosetting or liquid heat conduction glue (lipid) can go aging easily during the long using process, which leads the heat transfer capacity among interfaces of the light source and the shell (a radiator) to decrease greatly and leads the performance of LED lamps to decrease' does not exist. By adopting the invention, the heat transfer capacity of the LED lamp can be more excellent.
Description
technical field [0001] The invention relates to a method for manufacturing a light emitting diode (Light Emitting Diode, LED for short) lamp radiator. Background technique [0002] The existing manufacturing method of LED lamps is to coat a layer of thermosetting heat-conducting glue or liquid-phase heat-conducting grease on the interface between the LED light source and the housing. Then use screws to fasten the LED light source and the housing together; after a period of time, the glue-cured light source and the housing (radiator) form a structural bond and connect together after the LED lamp is lit. [0003] The main function of the thermosetting heat-conducting glue or liquid-phase heat-conducting grease coated on the interface between the LED light source and the housing is to increase the heat transfer capacity between the interfaces. However, thermosetting or liquid-phase heat-conducting adhesive (grease) is easy to age during long-term use, resulting in a significan...
Claims
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Login to View More IPC IPC(8): F21V19/00H01R43/02H01L33/00F21Y101/02F21Y115/10
Inventor 李锋
Owner 深圳可瑞高新材料股份有限公司