Detector device and detection method
A detection method and detector technology, applied in the direction of measuring devices, parts and instruments of electrical measuring instruments, etc., can solve problems such as unsolvable and difficult maintenance operations, and achieve the effect of miniaturization
Active Publication Date: 2011-07-20
TOKYO ELECTRON LTD
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Problems solved by technology
However, in order to replace the function board attached to the test head, the operator must use a ladder or the like to perform work at a high place, which has a problem that maintenance work is not easy
[0007] In addition, Patent Document 2 discloses a technique of finely adjusting the position and inclination of the test head by using a support mechanism after the test head is rotated and mounted at a predetermined position, but this technique cannot solve the above-mentioned problem. question
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[0053] refer to figure 1 ~ FIG. 3 , the detector device as the detector device of the present invention is described. The probe device includes: a probe main body 11 as an inspection device main body; a test head 12 ; and a loading portion 13 .
[0054] The probe main body 11 has a frame body 20 constituting an exterior part. As shown in Figure 2, in this frame body 20, be provided with: loading table 21, be used for loading the wafer W as the substrate to be inspected that is arranged on the surface and arrange a plurality of inspected chips; And moving mechanism 22, be used to make The stage 21 moves in the X, Y, and Z directions and rotates axially in the vertical direction. In this figure, reference numeral 23 is an X-direction moving part, reference numeral 24 is a Y-direction moving part, and reference numeral 25 is a Z-direction moving part. In addition, although not shown, a camera for imaging a probe 26 to be described later is provided on the Z-direction moving p...
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The invention provides a detector device and detecting method capable of detecting the electrical characteristics of the detected objects causing the detector to electrically contact with the electrode slice of the detected object, thereby realizing the miniaturization of the device and suitably install the testing head on the detector body. The method comprises keeping the testing head by using the keeping body to cause it to rotate from the retraction position leaving the top plate of the detector body to the horizontal position, connecting the testing head to a lifting support mechanism provided on the detector body, and using the lifting support mechanism to descend the testing head and installing the detector body on the testing head. Because the testing head does not interfere with the parts of the detector body in the rotating and descending process, the device is able to carry the hinge mechanism of the testing head on the upper surface of the detector body, thereby realizing the miniaturization of the device.
Description
technical field [0001] The present invention relates to a probe device and a detection method for electrically contacting a probe with an electrode pad of an object to be inspected to detect the electrical characteristics of the object to be inspected, and in particular to the driving of a test head part. Background technique [0002] In the manufacturing process of semiconductor devices, various electrical characteristics inspections are performed on integrated circuit chips after they are completed, so that it is possible to judge whether each integrated circuit chip is good or bad in the state before independence. This inspection is carried out as follows, that is, a semiconductor wafer (hereinafter simply referred to as "wafer") is placed on a mounting table, and the mounting table is raised so that the electrode pads of the integrated circuit chips on the wafer and the probe card ( probe card) such as probe contacts. In addition, recently, at the stage before the inte...
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IPC IPC(8): G01R31/26
CPCG01R1/07307G01R31/2601
Inventor 雨宫大作雨宫浩
Owner TOKYO ELECTRON LTD