Elastic heat conducting and radiating device

A technology of elastic heat conduction and heat dissipation device, which is used in semiconductor devices, cooling/ventilation/heating transformation, semiconductor/solid-state device components, etc., to achieve the effect of solving heat dissipation problems

Inactive Publication Date: 2009-03-18
李钧塘
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The main purpose of the present invention is to overcome the defects of the existing heat dissipation device, and provide a new type of elastic heat conduction heat dissipation device. The generated heat is exported to reduce the loa

Method used

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  • Elastic heat conducting and radiating device
  • Elastic heat conducting and radiating device
  • Elastic heat conducting and radiating device

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Embodiment Construction

[0037] In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation, structure, Features and their functions are described in detail below.

[0038] Please also see figure 2 and image 3 , the present invention is a circuit board 100 ( image 3 For the circuit board 100 and the housing wall 400, only a fragment is drawn for illustration), an elastic heat conduction and heat dissipation device for dissipating heat from an electronic component 110 on the circuit board 100, the present invention includes: a heat sink 310, It is fixed on the bottom of the circuit board 100 by means of a first adhesive layer 320 on the upper surface, which is used to guide the heat generated by the electronic components 110 on the circuit board 100 to the heat sink 310; and an elastic heat conducting seat 340...

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Abstract

The invention provides an elastic heat conducting and radiating device, comprising a heat radiating plate fixed onto bottom of the circuit board by a first adhesive layer, for directly conducting heat generated by electronic elements on the circuit board, and an elastic heat radiating seat fixed onto the other surface of the heat radiating plate by a second adhesive layer, for conducting heat on the heat radiating plate to outer case body of the product in contact with the elastic heat radiating seat. By large area of the outer case body of the product, and characteristic of direct contact with the external air, radiation heat transferring area is enhanced, so that heat radiation effect of electronic elements on the circuit board is improved.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device capable of improving the heat dissipation effect of electronic components on a circuit board. Background technique [0002] In recent years, various livelihood or consumer electronic products have gradually become indispensable in people's daily life. In general electronic products, the electronic components on the circuit board interact with each other, so that the electronic product can complete the expected work. However, the electronic components on the circuit board of electronic products will generate heat when the electronic product is in operation. If the heat cannot be transferred to the outside in a timely manner and accumulate on the circuit board, it will not only reduce the life of the electronic components (or even damage them), but also reduce the electronic components. Product performance. Therefore, in order to maintain the service life and...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/42
Inventor 李钧塘
Owner 李钧塘
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