Micro TCA system, Micro TCA system management method

A technology of system management and intelligent platform management, applied in the field of intelligent platform communication, can solve problems such as lowering system reliability, failure to manage AMC1, communication interruption, etc.

Inactive Publication Date: 2009-04-01
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] When a short-circuit fault occurs, the IPMB-L bus between MCH1 and AMC1 is short-circuited, and MCH1 cannot manage AMC1
Since the IPMB-L bus has a Y-shaped structure, the IPMB-L bus connection between MCH2 and AMC1 will also be suspended. Even if switching is performed, MCH2 cannot realize the normal management of AMC1. will be lost
[0012] When fault point 2 fails, the IPMB-L bus between MCH1 and AMC1, and the IPMB-L bus between MCH2 and AMC1 cannot work

Method used

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  • Micro TCA system, Micro TCA system management method
  • Micro TCA system, Micro TCA system management method
  • Micro TCA system, Micro TCA system management method

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Embodiment Construction

[0035] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0036] image 3 It shows the schematic diagram of the first embodiment of Micro TCA system in the present invention, including exchange control module 1, advanced mezzanine card 2 (AMC1), advanced mezzanine card 3 (AMC2), advanced mezzanine card 4 (AMC3), advanced mezzanine card 5 (AMC4). The switch control module 1 is connected to and communicates with AMC1, AMC2, AMC3, and AMC4 through intelligent platform management bus channels I, II, III, and IV respectively. exist image 3 In the shown embodiment, AMC1 and AMC2 are connected, and the channel connecting them is called an advanced mezzanine card interconnection channel, and AMC1 and AMC2 are connected through an advanced mezzanine card interconnection channel. Likewise, in image 3 In, AMC3 and AMC4 are also connected through the advanced mezzanine card interconnect channel. The advanced mezzanine ca...

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Abstract

The invention discloses a miniature telecommunications and computing common hardware platform architecture Micro TCA system, which comprises a swapping control module and a plurality of advanced mezzanie cards. In the advanced mezzanie cards, at least two advanced mezzanie cards are connected with each other by an advanced mezzanie cards interconnection channel. The invention also discloses a method for managing the Micro TCA system. By adopting the system and the method, one advanced mezzanie card can be connected with one or a plurality of advanced mezzanie cards by the advanced mezzanie cards interconnection channel to form one or a plurality of groups of substracts, thereby providing a redundant intelligent platform management bus channel for the advanced mezzanine cards. Therefore, the redundant intelligent platform management bus channel can be selected for communication of the advanced mezzanine cards and the swapping control module.

Description

technical field [0001] The present invention relates to the technical field of intelligent platform communication, in particular to a Micro TCA system and a Micro TCA system management method for a general hardware platform architecture (Micro Telecommunications Computing Architecture, Micro TCA). Background technique [0002] Micro TCA is a general hardware platform architecture for small telecommunications and computing developed by the Pedpherd Component Interconnect (PCI) Industrial Computer Manufacturers Group (PICMG) organization. Micro TCA uses the Advanced Mezzanine Card (Advanced Mezzanine Card, AMC) to build the system, the hot-swappable AMC can be directly plugged into the Micro TCA backplane. The basic specification of Micro TCA is MicroTCA.0, which defines the frame structure, management, power supply, heat dissipation and interconnection of MicroTCA. [0003] AMC is a general-purpose mezzanine card defined by PICMG that can support hot swapping. The specific t...

Claims

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Application Information

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IPC IPC(8): H04L12/02H04Q1/00H05K7/00
Inventor 陈成洪峰李善甫
Owner HUAWEI TECH CO LTD
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