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Circuit board and connection substrate

A circuit substrate and circuit board technology, which is applied in the structural connection of printed circuits, printed circuits, printed circuits, etc., can solve the problems of reduced output, increased cost, and complicated manufacturing process of rigid-flexible circuit boards to achieve high connection reliability , reduce size and weight, increase the effect of thickness

Inactive Publication Date: 2009-04-08
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the manufacturing process of the rigid-flex circuit board will become more complicated, resulting in reduced yield and increased cost (for example, Patent Document 2)

Method used

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  • Circuit board and connection substrate
  • Circuit board and connection substrate
  • Circuit board and connection substrate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0047] In this embodiment, it will be described as figure 1 In the circuit board 100 shown in , in the circuit board 100 , the first circuit substrate 111 and the second circuit substrate 112 are electrically connected through the connection substrate 110 .

[0048] image 3 (C) in is figure 1 A cross-sectional view of the circuit board 100 is shown. The circuit board 100 includes: a first circuit substrate 111 and a second circuit substrate 112 arranged at intervals, and a first conductor pad 125 and a second conductor pad 135 are respectively arranged on the first circuit substrate 111 and the second circuit substrate 112; and a connecting substrate 110, which includes a first conductor post 155 and a second conductor post 165 protruding from one side or the other side. The connection substrate 110 is provided to cover a part of the first circuit substrate 111 and the second circuit substrate 112 and bridge between the two circuit substrates.

[0049] The first conductor...

no. 2 example

[0096] The present embodiment relates to a connection substrate 110 including a first conductor post 155 and a second conductor post 165, in which one of the two conductor posts protrudes from the base material 32 side, and the other The conductor post protrudes from the cover layer 37 side. A circuit board manufactured together with the connection substrate according to the present embodiment will be described below.

[0097] A circuit substrate including a base material 32 , conductor circuits 31 formed on either side of the base material 32 , and a cover layer covering the conductor circuits 31 is prepared. A base material opening is formed on the circuit substrate. In more detail, a first hole is formed to penetrate the base material 32 to reach the conductor circuit 31 , and a second hole is formed to penetrate the cover layer 37 to reach the conductor circuit 31 . Therefore, the first conductor post 155 is formed in the first hole so as to protrude from the surface of ...

no. 3 example

[0100] Further, in this embodiment, the circuit board 100 including a plurality of connection substrates 113 , 114 having flexible portions will be described. Figure 6 (a) and (b) in (a) are a plan view and a cross-sectional view showing the circuit board according to the present embodiment, respectively. The circuit board 100 includes a region 170 in which the flexures overlap, and in the overlapped region 170 the lengths of the flexures differ. This configuration avoids friction between the flexible parts.

[0101] Such as Figure 6 As shown in (b), in the case where an external force is applied to the first circuit substrate 111 and the second circuit substrate 112 to separate them from each other, one of the two connecting substrates is stretched, and the other of the two connecting substrates One connecting substrate is loose. Preferably, as Figure 6 As shown in (a), the slack portion is formed in the overlapping region 170 of the flexible portions connecting the su...

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PUM

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Abstract

Disclosed is a circuit board comprising first and second circuit substrates arranged separate from each other and respectively provided with a first and second conductor pad, and a connection substrate having first and second conductor posts respectively projecting from one side or the other side. The connection substrate is so arranged as to cover a part of the first and second circuit substrates, thereby bridging the first and second circuit substrates. The first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad are arranged opposite to each other respectively. In addition, the connection substrate has connecting portions which are formed by melting a metal coating layer formed in advance on the surface of at least one of the first conductor post and the first conductor pad, as well as on the surface of at least one of the second conductor post and the second conductor pad. In this circuit board, the first and second circuit substrates are electrically connected with the connection substrate through the connecting portions.

Description

technical field [0001] The present invention relates to a circuit board and a connection substrate usable as components of an electronic device. Background technique [0002] In recent years, the development of the integration level of electronic devices has led to the continuous reduction of the size of the circuit substrates incorporated in the electronic devices. The demand for higher densities also places higher demands on the materials of these substrates, and the uses of such substrates are constantly being developed. In addition, in order to make the electronic device smaller in size and lighter in weight, a plurality of circuit substrates electrically connected to each other are densely arranged so as to increase the accommodation rate inside the device. [0003] This method of electrically connecting a plurality of circuit substrates includes inserting each circuit substrate into a connector. For example, a connector is provided on each circuit board, and terminal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
CPCH05K3/363H05K2201/09481H05K3/4007H05K1/148H05K2201/0394H05K2201/0367H05K1/14
Inventor 中马敏秋稻叶诚
Owner SUMITOMO BAKELITE CO LTD