Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer bonding apparatus and method

A wafer bonding and wafer technology, which is applied in optics, instruments, optomechanical equipment, etc., and can solve the problems of low wafer bonding and alignment accuracy.

Inactive Publication Date: 2009-05-13
DONGBU HITEK CO LTD
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In many related art wafer bonding processes, one notch is usually formed at a time, resulting in low alignment accuracy of wafer bonding

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer bonding apparatus and method
  • Wafer bonding apparatus and method
  • Wafer bonding apparatus and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The wafer bonding apparatus and method according to the embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0012] When the terms "on", "above" or "above" as used herein refer to layers, regions, patterns or structures, they should be understood as the layers, regions, patterns or The structure can be directly on another layer or structure, or on an intermediate layer, region, pattern or structure that may also be present. When the terms "under", "under" or "under" used herein refer to layers, regions, patterns or structures, they should be understood as the layers, regions, patterns or The structure may be directly under another layer or structure, or under an intermediate layer, region, pattern, or structure that may also be present.

[0013] Figure 1A with Figure 1B It is a schematic diagram showing an alignment unit of a wafer bonding apparatus according to an embodiment of the present invention.

[0014...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A wafer bonding apparatus and method are provided. The wafer bonding apparatus can include an aligning unit, and the aligning unit can include a rotating roller for rotating at least two wafers, an aligning bar for aligning the at least two wafers, and a notch alignment sensor for sensing at least two notches of each of the at least two wafers.

Description

Technical field [0001] The invention relates to a wafer bonding device and method. Background technique [0002] In the process of preparing semiconductor chips for various purposes, sometimes a bonding process is performed on two or more wafers. In this wafer bonding process, alignment accuracy is critical. [0003] In many wafer bonding processes of related technologies, one notch is usually formed at a time, resulting in low alignment accuracy of wafer bonding. [0004] Therefore, there is a need to improve wafer bonding devices and processes in this field. Summary of the invention [0005] The object of the present invention is to provide a wafer bonding apparatus and method capable of improving the alignment accuracy between two or more wafers. [0006] In one embodiment, the wafer bonding apparatus may include: an alignment unit, and the alignment unit may include: a rotating roller to rotate at least two wafers; an alignment rod to align the at least two wafers And a groo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02H01L21/18H01L21/20H01L21/68
CPCH01L21/68G03F7/7085
Inventor 韩昌勋
Owner DONGBU HITEK CO LTD