Metal carrier band for packaging noncontact module with large size

A module packaging, non-contact technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of changing the production process, large-scale promotion and application difficulties, and achieve the effect of good application prospects
CN101447465AInactive Publication Date: 2009-06-03SHANGHAI CHANGFENG SMART CARD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI CHANGFENG SMART CARD
Publication Date
2009-06-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a metal carrier band for packaging a noncontact module with large size which is characterized in that the metal carrier band comprises a chip bearing region which can bear a chip of 3.9*4.5mm. The chip which is 1.5 times of the area of a common chip can be bear and packaged, and a module product with the same mechanical size is obtained. By the improvement of the metal carrier band and under the premise of the increased size of the packaged chip, the combining force of a mould body with the metal carrier band is improved to the maximum extent after the mould packaging, therefore, the mechanical force resistance of internal devices is improved greatly. The carrier band is packaged in a reeling way. Under the premise of not adding the investment, the present conventional packaging process and the existing equipment can be used for producing products with better quality, therefore, the application of high-end chips, such as noncontact intelligent electronic passport, EMV band card, and the like in the intelligent card field is expanded.
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Description

technical field

[0001] The invention relates to the technical field of microelectronic semiconductor packaging, in particular to the technical field of non-contact smart card module packaging. In particular, it is a metal carrier tape for large-size non-contact module packaging. Background technique

[0002] With the continuous improvement of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, and the functions are becoming more and more abundant. It is required to accommodate larger chips in a relatively small package size. Under the premise that the size and thickness of integrated circuit products remain unchanged, the packaging of some chips has reached the limit of packaging equipment and technology. For example, the current traditional contactless smart card modules used for contactless cards (such as public transportation cards, China's second-generation ID cards and most other applications) have an external...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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