35results about How to "Size does not change" patented technology

The invention relates to a three-dimensional seism isolation system, which comprises preburied parts, first horizontal limit springs, a connecting plate, a horizontal slide bearing sliding plate, a horizontal slide bearing slider, upper slope leveling connecting plates, flush bolts, lead rubber bearings, second horizontal limit springs, lower slope leveling connecting plates and retaining blocks. Vertical seism is isolated by the deformation displacement of the inclined lead rubber bearings; horizontal seism is isolated by the sliding of the horizontal slide bearing slider; restoring force is supplied by the springs, and thereby the purpose of three-dimensional seism/vibration absorption is realized. The novel three-dimensional seism isolation system can protect protected objects of an upper building during horizontal and vertical vibration and seism and effectively attenuate the vibration transmission of vibrating equipment. The three-dimensional seism isolation system is applicable to the seism and vibration control and protection of building structures and large equipment.

The invention relates to the communication field and discloses a downlink?control?information (DCI) transmission method under cross band carrier aggregation and a downlink?control information (DCI) transmission device under the cross band carrier aggregation. The downlink?control? information (DCI) transmission method comprises the following steps that: long?term?evolution-advanced user equipment (LTE-A UE) which is aggregated with carriers with different time?division?duplex (TDD) uplink/downlink configuration acquires configuration information according to a pre-agreed rule or high-level signaling and determines whether a downlink control?information (DCI) format which is used by a physical downlink control channel (PDCCH) contains a downlink?assignment?index (DAI) and an uplink (UL) index, wherein the physical downlink control channel (PDCCH) is used for scheduling a physical uplink shared channel (PUSCH); and the above operation in the above step is performed on a common?search?space (CSS) and an UE-specific?search?space (USS) independently and respectively. By means of the above technical schemes, it can be ensured that the size of downlink control?information (DCI) which is transmitted in the common?search?space (CSS) does not change, and therefore, normal transmission of public information of a community can be ensured; and at the same time, a specific bit field in the downlink control?information (DCI) can be reasonably determined in the UE-specific?search?space (USS) according to actual requirements, and therefore, uplink (UL) multi-frame scheduling and/or resource cost control of ACK/NACK on the physical uplink shared channel (PUSCH) can be supported.

The invention discloses a separation type damping energy consumption three-dimensional seismic isolation support which comprises a horizontal seismic isolation unit arranged between an upper structure and a middle bearing platform, and a vertical seismic isolation unit arranged between the middle bearing platform and a foundation bearing platform. The horizontal seismic isolation unit is a vertical lead rubber support which is axially and vertically installed, and the vertical seismic isolation unit is formed by connecting at least two inclined lead rubber supports equal in size specification in parallel to form a set of outward expanding cylindrical structure in space symmetry so that the vertical deformation borne by the vertical seismic isolation unit can be transformed into inclined deformation and outward expanding displacement of the inclined rubber supports. An upper friction plate and a lower friction plate are arranged between the vertical seismic isolation unit and the middle bearing platform, and initial supporting force is provided and seism/vibration energy is dissipated through friction sliding of a contact face. According to the separation type damping energy consumption three-dimensional seismic isolation support, seism and environment vibration in three directions can be isolated at the same time, the seism/vibration response and seism/vibration transmission of a protected structure or device with the separation type damping energy consumption three-dimensional seismic isolation support are effectively controlled, and the safety under the seism/vibration action is protected.

The invention discloses an intelligent luminous auto logo assembly. The auto logo assembly comprises a scutcheon panel, a lower cover and a PCB lamp panel module arranged between the scutcheon panel and the lower cover, wherein the scutcheon panel is a transparent plastic part, and the rear surface of the scutcheon panel comprises a groove part allowing light rays to pass therethrough and a non-groove part for blocking the light rays to pass therethrough; after an ink layer is formed on the surface of the non-groove part though silk screen, a primer layer, a nanometer metal coating and a protective paint layer are arranged on the rear surface of the scutcheon panel from inside to outside; a plurality of LED lamp beads are arranged on the PCB lamp panel module, and the plurality of LED lampbeads are arranged at the positions, corresponding to the groove part of the scutcheon panel; and after the LED lamp beads are lighted, the light rays penetrate through the groove part to show a luminous pattern, and when the LED lamp beads are extinguished, the groove part shows a pattern with metal texture. The intelligent luminous auto logo assembly has the advantages of being convenient to manufacture, and suitable for industrial mass production.

The invention provides a metal carrier band for packaging a noncontact module with large size which is characterized in that the metal carrier band comprises a chip bearing region which can bear a chip of 3.9*4.5mm. The chip which is 1.5 times of the area of a common chip can be bear and packaged, and a module product with the same mechanical size is obtained. By the improvement of the metal carrier band and under the premise of the increased size of the packaged chip, the combining force of a mould body with the metal carrier band is improved to the maximum extent after the mould packaging, therefore, the mechanical force resistance of internal devices is improved greatly. The carrier band is packaged in a reeling way. Under the premise of not adding the investment, the present conventional packaging process and the existing equipment can be used for producing products with better quality, therefore, the application of high-end chips, such as noncontact intelligent electronic passport, EMV band card, and the like in the intelligent card field is expanded.

The invention discloses an anti-seismic threaded pipeline connecting part. The anti-seismic threaded pipeline connecting part comprises a connecting part socket, a connecting part inserting opening, awater-stop rubber ring, a socket flange plate and an inserting opening flange plate. An annular protrusion and an inner screw thread are disposed in the connecting part socket; a circle of annular groove and an outer screw thread are formed in an inserting opening pipeline, and in order to conveniently perform mounting, 15 degree-45 degree slope treatment is performed on all portions of the connecting part. In the mounting process of the connecting part inserting opening, the water-strop rubber ring is squeezed and deform to be fixed at the inserting opening annular groove, and therefore theeffects of sealing and water stopping are enhanced. When the pulling force exerted on a pipeline is small, the anti-pulling force is provided by the frictional force between the connecting part inserting opening and the water-stop rubber ring; and when the pulling force is larger than the frictional force, the inserting opening annular groove is pulled by a certain distance, then the inner screw thread of the connecting part socket makes contact with and is engaged with the outer screw thread of the inserting opening, the connecting part is prevented from continuing to be pulled and separated,and therefore the function of restraining excessive deformation and failure of the pipeline is achieved.

The present invention discloses a PCB structure. The structure comprises a main body and a bonding pad arranged on the main body; the bonding pad includes a group of bonding pads arranged at the fixed region of the main body, and the group of bonding pads include the centre bonding pads arranged on the fixed region of the main body and outer ring bonding pads arranged around the centre boding pads, wherein the distance between the outer ring bonding pads and the centre bonding pads is larger than or equal to 0.4mm. The distance between the outer ring bonding pads and the centre bonding pads is larger than or equal to 0.4mm to allow the tin connection phenomenon between the outer ring bonding pads arranged around the centre boding pads to greatly reduce. The PCB structure changes the distance between the outer ring bonding pads arranged around the centre boding pads through the accurate calculation of the element boding pads to allow the distance of the outer ring bonding pads arranged around the centre boding pads to be enlarged, and the group of the improved outer ring bonding pads and the centre bonding pads are not liable to the tin connection phenomenon at the wave soldering so as to greatly improve the production efficiency and save the manpower cost.

The invention discloses an intelligent luminous threshold panel assembly which comprises a base and a threshold panel fixed on the top of the base, wherein a mounting cavity is formed between the baseand the threshold panel; a PCB lamp panel module is arranged on the inner side wall of the mounting cavity; a light-dispersing sheet and a threshold mark are arranged in the mounting cavity; the light-dispersing sheet jacks and presses the threshold mark below the threshold panel; the PCB lamp panel module is perpendicular to the plane of the light-dispersing sheet; a bulged light-pervious mark is arranged at the top of the threshold mark; the threshold panel is provided with a hollow part for exposing the bulged light-pervious mark; and the PCB lamp panel module displays normally light, absorption or water flowing effects outward through the light-dispersing sheet and the bulged light-pervious mark. The intelligent luminous threshold panel assembly solves the problem that the traditionalluminous threshold has the static-state luminous effect only, and is simple in structure, unchanged in size, convenient to manufacture and suitable for industrialized large-scale production.

The invention relates to the technical field of vehicle exhaust decorating rings, and discloses a vehicle exhaust pipe decorating ring with a deep hole electroplating hanger. The vehicle exhaust pipedecorating ring comprises a tail door exhaust pipe decorating ring; and an exhaust pipe bracket is fixedly connected to one side of the tail door exhaust pipe decorating ring. The vehicle exhaust pipedecorating ring with the deep hole electroplating hanger is fixedly provided with connecting rods in the tail door exhaust pipe decorating ring; two connecting rods are provided; the tail door exhaust pipe decorating ring is fixedly connected with the exhaust pipe bracket through the connecting rods, so that the exhaust pipe bracket is more stable to prevent shaking during vehicle driving; meanwhile, the exhaust pipe bracket comprises a box body; the bottom of the box body is fixedly connected with a base; and a damping bolt is fixedly arranged in the base for achieving a buffering effect during acute driving to prevent damage of some internal parts by the inertia and achieving a relieving effect on vibration generated during operation of the exhaust pipe bracket to reduce self impact.

The invention discloses a package structure of a semiconductor power device and electrodes of the package structure. The electrodes at an interior of the package structure are improved, and the electrodes are designed in a manner that the resistance of the electrodes decreases gradually from inside to outside. Because of the mutual inductance between all of the electrodes, the current is high at the outside and low at the center and is distributed similar to the skin effect; and since the resistance of the electrodes is the same, the current distribution is mainly affected by the skin effect.The resistance of the electrodes increases from inside to outside, thus the influence of the skin effect is weakened so that the currents of the electrodes tend to be uniform. In the electrode manufacturing stage, the size of the electrodes is changed, whereas the electrode distribution and the size of a package structure are not changed, thus the device size is not influenced, and the current sharing of multiple semiconductor power devices can be well implemented without increasing the package size.

The invention discloses a processing technology for solving a rough joint line of a PET bottle preform. The processing technology comprises the following steps: S1, carrying out forming processing on a butt joint opening of a cavity to be formed; carrying out axial outer circle grinding on the butt joint opening of the to-be-formed cavity to form a first forming section a; carrying out forming processing on a butt joint port of the to-be-formed sprue mold core; when the cavity is in butt joint with the sprue mold core, forming, by the first forming section a and the second forming section b, a smooth butt joint section; S2, carrying out forming processing of a cavity to be formed; forming and processing a to-be-formed pouring gate mold core; S3, carrying out butt joint on the cavity with the sprue mold core; and S4, polishing, grinding and brightening a butt joint port of the cavity and the sprue mold core. According to the invention, the excircles of the cavity and the sprue mold core are ground in place, then the grinding positions of the excircles are turned and formed, and finally the joint line position is ground, polished and brightened, so that the problem that the joint line of the formed PET bottle preform is rough is solved, the quality of the formed bottle preform is ensured, and the appearance of the formed product and the bottle blowing effect of the formed bottle preform are further ensured.

The invention discloses a front area adjustable pressure bar device of a flax wet spinning frame and a using method of the device. The front area adjustable pressure bar device comprises yarn, a frame, a roller stand and a cradle, wherein the frame is fixed to the roller stand; the cradle is arranged on the frame; a leather ring piece, a front pressure bar, a front upper roller and a front lower roller are arranged in the frame; a middle lower roller is arranged in the leather ring piece; the end part of the leather ring piece is sleeved with a sliding roller; the sliding roller and the front pressure bar are arranged on the two sides of the yarn; the front upper roller and the front lower roller are arranged on the two sides of the yarn; a first pressure bar support and a second pressure bar support are fixed to the frame and connected; and the front pressure bar is arranged at the end part of the first pressure bar support. According to the invention, the first pressure bar support, the second pressure bar support and the front pressure bar are assembled and matched for use, so that the quality of the flax wet spinning frame is improved, and the position and operation of the pressure bar are convenient to adjust.

The invention discloses a metal compound high-temperature-resistant film material, particularly relates to an inorganic metal compound hydrophobic film and overcomes the defects of the existing electroplated layer, organic coating and inorganic coating. The inorganic metal compound hydrophobic film is prepared from the following raw materials in percentage by weight: 13-17% of aluminum powder, 1-5% of lithium oxide, 43-47% of titanium powder, 8-12% of carbon powder, 15-20% of iron powder and 8-12% of silicon dioxide. When being sprayed on a metal surface, the inorganic metal compound hydrophobic film disclosed by the invention has the advantages of high temperature resistance, environment corrosion resistance, hydrophobicity, high hardness, high smoothness, basically-invariant size and the like, can replace a partial electroplating process, is used for solving the problem of environment pollution caused by electroplating wastes and can save time, labor and effort. When being used on the surface of an airspeed head, the inorganic metal compound hydrophobic film is remarkable in effect, resistant to 550-DEG C high temperature and good in environment corrosion resistance and has higher conductivity and hardness than an electroplated layer.