Printed circuit board and manufacturing method thereof
A technology of printed circuit boards and conductive materials, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of difficult to achieve small pitch, poor interconnection, and reduced bonding strength
Inactive Publication Date: 2009-06-10
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
According to the existing technology, in order to ensure a specific contact area (also called area) between the through hole 5 and the pad 3, the pad 3 and the through hole 5 must form an area corresponding to the width, making it difficult to achieve a small pitch
[0008] Thus, in the structure of the printed circuit board according to the prior art, the problem of poor interconnection due to smear and insulation residue, the problem of reliability due to the reduction of the bonding strength between the pad 3 and the through hole 5 problems, as well as crack problems, become important problems to be solved
Method used
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[0023] As the invention allows for many changes and numerous embodiments, specific embodiments will be illustrated in the drawings and set forth in detail in the written description. However, this is not intended to limit the present invention to a specific mode of implementation, and it is conceivable that all changes, equivalents, and replacements that do not depart from the spirit and technical scope of the present invention are included in the present invention. In describing the present invention, specific detailed descriptions of related art will be omitted when it is considered that they may unnecessarily obscure the essence of the present invention.
[0024] Terms such as 'first', 'second', etc. may be used to describe various elements, and such elements are not limited to the above terms. The above terms are only used to distinguish one element from another.
[0025] The terms used in the present invention are only used to describe specific embodiments, and are not u...
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A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability.
Description
[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2007-0124567 filed with the Korean Intellectual Property Office on December 3, 2007, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a printed circuit board and a manufacturing method for the printed circuit board. Background technique [0004] In printed circuit boards, vias can be formed in the insulator used for interconnection between multiple layers, mainly using laser drilling. [0005] That is, in order to interconnect the upper and lower layers, holes are formed in the insulating layer using laser drilling, and then a desmear process is performed to remove smear and insulating residues. Then, the processed holes are filled with conductive material, and electroless copper plating and electroplating are used to interconnect the upper and lower layers. [0006] figu...
Claims
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IPC IPC(8): H05K1/02H05K1/11H05K3/42
CPCH05K2201/09563H05K3/421H05K3/108H05K3/423H05K2201/09545H05K2201/096Y10T29/49165H05K1/02H05K1/11
Inventor 赵贞禹柳彰燮曹淳镇金升彻
Owner SAMSUNG ELECTRO MECHANICS CO LTD