Compact wafer automatic transfer unit
An automatic transmission and compact technology, applied in the direction of transportation and packaging, conveyor objects, etc., can solve the problem of reducing the overall height, and achieve the effect of reducing the overall height and width, reasonable structure design, and compact structure design.
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[0035] according to Figures 1 to 10 The specific structure of this invention is demonstrated in detail. The flip-type wafer automatic transfer device is based on inheriting the advantages of patented technologies such as "a method of delivering wafers for IC manufacturing process" in US Patent 6,086,323, and is redesigned according to the defects existing in the prior art. It includes a frame 1, a loading platform 21 fixed on the frame 1, a bellows body 22 with a claw mechanism 20 assembled on the frame 1 for lifting and moving, and a bellows body 22 with a grasping mechanism 20 for lifting and extending movement. The arm mechanism 19 of the mechanism 24 and the like. The bellows body 22 is an integrated air filtration system, which can provide a clean micro-environment. Its working principle is basically the same as the method in the above-mentioned US patent technology, and will not be repeated here.
[0036] like figure 1 , 2 As shown, the bellows body 22 is assembled...
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