Flat suction nozzle and chip fetching/laying machine as well as semiconductor test method thereof

Abstract

The invention relates to a flat nozzle and chip-pick and -place machine and semiconductor test method. The flat nozzle is arranged at the chip-pick and -place machine for picking and placing semiconductor chips which have a plurality of electro-conductive projections, the flat nozzle comprises a nozzle body, at least one gas channel and a contacting portion, the gas channel has an opening on the contacting portion for adsorbing semiconductor chips, the contacting portion can cross a plurality of electro-conductive projections on the chips, the chip-pick and -place machine comprises a mechanical arm and at least one flat nozzle sleeved at the machine arm to pick and place the semiconductor chips with a plurality of electro-conductive projections, and the semiconductor test method is characterized in that a semiconductor chip is absorbed by the flat nozzle and the semiconductor chip is placed in a box disc. The invention can not only avoid from scoring chip projections, but also the chip design cannot waste the limited area of chips due to the restricted picking and placing, which can be extensively applied to various chips and various semiconductor seal-measure methods and reduce the scoring of chips when in picking and placing.

Description

technical field [0001] The invention relates to a semiconductor chip pick-and-place suction nozzle, a chip pick-and-place machine and a testing method thereof, in particular to a flat suction nozzle, a chip pick-and-place machine capable of avoiding chip bumps being scratched, and a semiconductor testing method thereof. Background technique [0002] With the advancement of semiconductor technology, electronic components using Flip Chip Interconnect Technology have gradually become the mainstream of future miniaturization and lightweight electronic components. This technology utilizes conductive bumps on chips (chips or wafers, which are referred to herein as chips) for electrical and structural connections. During the chip transfer process, the conductive bumps are scratched. [0003] Please refer to FIG. 1A and FIG. 1B , which are respectively a schematic side view and a schematic bottom view of a conventional suction nozzle. The existing known suction nozzle 100 is arran...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the defects of the existing flat suction nozzle and provide a flat suction nozzle with a new structure. The technical problem to be solved is to make it not only avoid scratching chip bumps, It will not be limited by pick and place, so the limited chip area is wasted, which is very suitable for practical

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