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heat sink

A technology for a heat sink and a heat sink set, which is applied in cooling/ventilation/heating transformation, electrical components, electrical solid devices, etc., can solve problems such as affecting the heat dissipation efficiency of the heat sink, and achieve the effect of improving strength and ensuring heat dissipation efficiency.

Inactive Publication Date: 2011-12-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the heat sink works for a period of time, due to the pressure of the fan, frequent vibrations and the pressure of the heat sink, the heat pipe bends to the opposite side of the connecting section, which affects the heat dissipation efficiency of the heat sink

Method used

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Embodiment Construction

[0012] Such as figure 1 and figure 2 As shown, the heat dissipation device of the present invention is used to dissipate heat from electronic components (not shown) fixed on a circuit board (not shown). The heat dissipation device includes a substrate 20 in contact with electronic components, a heat sink group (not shown in the figure) arranged above the substrate 20, a heat pipe group 50 connecting the substrate 20 and the heat sink group, and a fan installed above the heat sink group. 70. Two fan fixing frames 60 connecting the fan 70 and the heat sink group and the two mounting frames 10 connected with the substrate 20 to fix the substrate 20 on the circuit board, wherein the heat sink group includes the first heat sink group 30 and the second heat sink group Heat sink group 40 .

[0013] The heat pipe set 50 includes two first heat pipes 51 disposed on one side of the substrate 20 and two second heat pipes 53 disposed on the other side of the substrate 20 . These first...

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PUM

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Abstract

A heat dissipation device for dissipating heat from electronic components fixed on a circuit board, comprising a base plate, a set of heat sinks arranged above the base plate and spaced apart from the base plate, and a first set of heat sinks connecting the base plate and the set of heat sinks The heat pipe, the second heat pipe and a fan arranged above the heat sink group, the first and second heat pipes respectively include an evaporation section and a condensation section, and the evaporation sections of the first and second heat pipes pass through the In the base plate, the condensing sections of the first and second heat pipes respectively pass through the heat sink set from opposite directions to support the heat sink set. Compared with the prior art, the two heat pipes of the heat sink of the present invention pass through the opposite sides of the heat sink group and support the heat sink group, thereby avoiding the bending of the heat pipe to one side after being pressed, and improving the strength of the heat sink , thereby ensuring the heat dissipation efficiency of the heat dissipation device.

Description

technical field [0001] The invention relates to a cooling device, in particular to a cooling device for cooling electronic components. Background technique [0002] As we all know, electronic components such as central processing units generate a lot of heat during operation. In order to prevent the temperature of the electronic component from rising due to the accumulation of heat and thus cause its operation to be unstable, the electronic component usually needs to be equipped with a heat dissipation device to assist in heat dissipation. [0003] A traditional heat dissipation device includes a plurality of heat sinks arranged parallel to each other and equidistantly spaced, a substrate attached to the electronic components, a heat pipe connecting the substrate and the heat sink, and a fan installed above the heat sink. The heat sink is spaced apart from the base plate. The heat pipe has an evaporating section accommodated in the base plate, a condensing section passing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/427
Inventor 徐宏博
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD