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Wiring board and solid-state imaging device

A technology for a solid-state imaging device and a wiring substrate, which is applied in the direction of electric solid-state devices, semiconductor devices, printed circuits, etc., can solve the problem of high price and achieve the effect of high versatility

Active Publication Date: 2009-07-22
HAMAMATSU PHOTONICS KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, the back-illuminated solid-state imaging device is more expensive than the surface-illuminated solid-state imaging device because a thinned part is formed on the solid-state imaging element.

Method used

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  • Wiring board and solid-state imaging device
  • Wiring board and solid-state imaging device
  • Wiring board and solid-state imaging device

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Experimental program
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Embodiment Construction

[0026] The findings of the present invention can be easily understood in consideration of the following detailed description with reference to the merely illustrative drawings. Next, embodiments of the present invention will be described with reference to the drawings. Where possible, the same symbols are assigned to the same parts, and repeated explanations are omitted.

[0027] refer to figure 1 and figure 2 , the wiring board of this embodiment will be described. figure 1 It is a schematic plan view of one embodiment of the wiring board of the present invention. figure 2 yes figure 1 A cross-sectional view along the line II-II of the wiring board in . The wiring board 1 includes a rectangular ceramic multilayer substrate (ceramic material, such as aluminum nitride) 11 in plan view, and a first electrode pad 12, a second electrode pad 13, and an alignment substrate are formed at predetermined positions on the surface thereof. sign 14. In addition, internal wiring 15...

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Abstract

The invention provides a wiring board on which either a surface-incident element or a rear-surface-incident element can be mounted, and a solid-state imaging device. The wiring board 1 has a planned placement region 1a on which a solid-state imaging element is to be placed; and includes a plurality of first electrode pads 12 formed within the region 1a, and a plurality of second electrode pads 13 formed outside the region 1a and electrically connected with the first pads 12, respectively. In addition, the solid-state imaging device has a rear-surface-incident solid-state imaging element or a surface-incident solid-state imaging element mounted on the wiring board 1.

Description

technical field [0001] The present invention relates to a wiring board for mounting a solid-state imaging element and a solid-state imaging device. Background technique [0002] As a solid-state imaging device in which a solid-state imaging element is mounted on a wiring board, a front-illuminated solid-state imaging device and a back-illuminated solid-state imaging device are conventionally known. A surface-illuminated solid-state imaging device includes a solid-state imaging element in which a photodetection unit and a terminal electrode electrically connected to the photodetection unit are provided on one surface, and this surface is a light-receiving surface, the solid-state imaging element is mounted on a wiring board, and the solid-state imaging The other surface of the element faces the wiring board, and the terminal electrodes of the solid-state imaging element and the electrode pads of the wiring board are connected by wire bonding. (For example, refer to Patent Do...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/14H05K1/02
CPCH01L2924/01004H05K1/0295H05K2201/09954H05K2203/049H05K1/112H01L2224/48227H05K1/0269H05K2201/09254H05K2201/09918H01L27/14618H05K2201/10674H01L2224/48091H05K2203/166H01L2224/73265H01L2224/32225H01L2924/15192H01L2224/0401H01L2224/04042H01L2224/16225H01L24/73H01L2924/00014H01L2924/00012H05K1/02H01L27/14
Inventor 米田康人铃木久则小林宏也村松雅治
Owner HAMAMATSU PHOTONICS KK