Apparatus and method for processing plate-like object by wet process

Abstract

The invention relates to a device and a method for treating disks with wet technique. comprising a carrier for carrying disks and causing the disks to rotate. A distributor is positioned above the carrier which is used for distributing the liquid on at least one surface of the disks, and an annular liquid collector is arranged on the peripheral of the carrier; the carrier is located near the collar extension of the annular liquid collector; the annular liquid collector is provided with an internal layer, an external layer and at least one intermediate layer, a fixed segment and an elevating segment are respectively positioned on the external layer and the intermediate layer, the fixed segment of the external layer is connected with the fixed segment of the intermediate layer, the fixed segment of the intermediate layer and the internal layer are connected with the fixed frame together and the elevating segment of the intermediate layer is connected with the elevating mechanism. The device and the method for treating the disks with wet technique can change the relative axial position of the annular cavity and the wafer by the intermediate layer which can be elevated up and down in the liquid collector so as to cause the liquid of different technologies to flow into different annular cavities, thus realizing the separate recycle of technology liquids after the technologies are finished.

Description

technical field [0001] The invention relates to a processing machine and a processing method of discs, in particular to a device for processing discs by wet method. Background technique [0002] Wafers as used herein represent various types of disks, such as semiconductor wafers, optical disks, or flat panel displays. [0003] In the prior art, devices for handling discs are commonly used in this field. For example, in US patent application No. US1663023, a device for wet processing of flat substrates is disclosed. In this patent, by driving the carrier and the liquid capture ring up and down, the liquid capture ring is aligned with different annular chambers in different process stages of the wafer, thereby realizing the separate collection of different liquids. During the process, since the carrier generally drives the wafer to rotate at high speed, at different process stages, the carrier and the liquid capture ring have to move up and down. This puts forward higher re...

AI Technical Summary

Problems solved by technology

The annular chamber recovers or drains the collected liquid through the pipeline. The annular chamber rises and falls up and down, and the pipeline also rises and falls together with the annular chamber, which shortens the life of the pipeline, and due to the guidance of the pipeline The structure is relatively complicated, which also affects the reliability and stability of the device

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