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Method for locating naked chip and jig structure thereof

A positioning method, bare chip technology, used in conveyor objects, electrical components, semiconductor/solid-state device manufacturing, etc.

Inactive Publication Date: 2011-11-02
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015]2. Only the bare chip 2a with a relatively simple geometric shape can be positioned, but the bare chip with a complex geometric shape cannot be positioned, which greatly limits the Availability of location devices

Method used

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  • Method for locating naked chip and jig structure thereof
  • Method for locating naked chip and jig structure thereof
  • Method for locating naked chip and jig structure thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0056] see Figure 5 As shown, there is a burr 11 on the upper edge of the side surface of the bare chip 1 , which is formed during wafer dicing and splitting. However, the burr 11 can also be eliminated by other processing methods.

[0057] The stacking element 2 is an insulator, such as a color filter that can sufficiently penetrate light. The stacking component 2 is dislocated on the upper surface of the bare chip 1 in a stacking manner, and the stacking component 2 can be fixed on the bare chip 1 by gluing.

[0058] One side of the stack 2 is non-flush with the side corresponding to the bare chip 1, and the upper end surface 12 of the bare chip 1 adjacent to one side of the stack 2 is partially exposed, and this A part of the exposed part is the wire bonding area 13 of the bare chip 1 , and the wire bonding area 13 can be connected with conductive wires.

[0059] The other side of the stack member 2 is not flush with the other side corresponding to the bare chip 1 , and ...

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PUM

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Abstract

The invention relates to a method for locating a bare chip and a fixture structure thereof. The fixture structure is used to locate at least one bare chip and comprises a tray which is provided with at least one locating slot the depth of which is less than the height of the bare chip. The method for locating the bare chip comprises the following steps: Step 1: providing a bare chip; Step 2: providing a tray with at least one locating slot; Step 3: placing the bare chip to a corresponding locating slot the depth of which is less than the height of the bare chip; and Step 4: providing a suction nozzle to directly suck the bare chip and move the bare chip to a preset position on a circuit board. With the setting of the locating slot of the tray, when the bare chip is placed in the locating slot, the locating is finished and the suction nozzle can directly and accurately suck the bare chip, thus greatly reducing the steps of locating the bare chips.

Description

technical field [0001] The invention provides a bare chip positioning method and its jig structure, and in particular relates to a method and a jig structure for placing and positioning the bare chip to facilitate subsequent processes. Background technique [0002] In the packaging process of the electronics industry, the bare chip is generally picked up by a suction nozzle and moved to the circuit board for subsequent processing operations such as packaging. [0003] Please refer to figure 1 and figure 2 As shown, it shows a known positioning method for bare chips. First, a tray 1a is provided. ). [0004] The bare chip 2a is correspondingly placed in the positioning groove 11a, and the depth of the positioning groove 11a is higher than the height of the bare chip 2a. [0005] Then the bare chip 2a is picked up by the suction nozzle 3a and moved to the top of a charge coupled device 4a (CCD, Charge Coupled Device), and the center position of the bare chip 2a is confirm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/677
Inventor 张卓兴
Owner UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD