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Side compression type ultrasound grinding and polishing device, and method thereof

A polishing device and ultrasonic technology are applied in the fields of ultrasonic grinding and polishing devices and side-pressure ultrasonic grinding and polishing devices to achieve the effects of stable performance, reduced frequency and low cost.

Active Publication Date: 2011-06-08
北京迪蒙吉意超硬材料技术有限公司
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  • Claims
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AI Technical Summary

Problems solved by technology

Although the semi-automatic ultrasonic grinding and polishing machine reduces the difficulty of tool needle grinding, improves the repeatability of grinding, and saves the man-hours spent on loading and unloading tool needles, it still continues the profiling processing method commonly used by traditional ultrasonic grinding and polishing machines , has an absolute dependence on the accuracy of the grinding angle of the tool needle, and does not essentially get rid of the influence caused by repeated grinding on the machining, so the structure of the machine itself and the shape and position accuracy of the parts related to the grinding tool needle are very high requirements

Method used

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  • Side compression type ultrasound grinding and polishing device, and method thereof
  • Side compression type ultrasound grinding and polishing device, and method thereof
  • Side compression type ultrasound grinding and polishing device, and method thereof

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Embodiment Construction

[0028] As mentioned above, all the working pressures of the existing ultrasonic grinding and polishing machines adopt the positive pressure type, that is, the pressure direction between the tool needle and the workpiece is parallel to the vibration direction of the ultrasonic longitudinal wave. In the present invention, the working pressure direction of the ultrasonic machining of the existing grinding machine is changed to the side direction, that is, it is perpendicular to the vibration direction of the ultrasonic longitudinal wave, so that the side of the tool needle is close to the machined surface of the inner hole of the mold. On this basis, increase the reciprocating swing of the tool needle. During the machining process, the tool needle and the contact surface of the workpiece are always kept in relative motion. In order to make the processing not be affected by the grinding accuracy of the tool needle, the side pressure ultrasonic grinding and polishing device also ad...

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Abstract

The invention discloses a lateral pressure ultrasonic grinding-and-polishing device which comprises an energy converter for producing ultrasonic wave and a tooling pin fixed on the upper part of the energy converter; wherein the energy converter is fixed on an energy converter fixed seat; one side of the energy converter fixed seat is equipped with a pressure device; the tooling pin is injected into an alignment control gauge, and the alignment control gauge is installed on a rotary clamp; the rotary clamp is fixed on a work table able to adjust the angle according to the processing needs; the work pressure direction of the tooling pin is vertical to the longitudinal wave vibration direction of the ultrasonic wave given off by the energy converter. The lateral pressure ultrasonic grinding-and-polishing device has the advantages of simple structure, low cost, stable performance and easy operation. The lateral pressure ultrasonic grinding-and-polishing device can effectively reduce the processing difficulty of the diamond wire-drawing die, reduce the times of figuring the tooling pin, eliminate the impact of the deviation of the tooling pin during the polishing process on the processing and improve the production efficiency.

Description

technical field [0001] The invention relates to a lateral pressure ultrasonic grinding and polishing device, in particular to an ultrasonic grinding and polishing device with lateral ultrasonic working pressure and suitable for producing diamond wire drawing dies, and also relates to a method for realizing ultrasonic grinding and polishing of the device, belonging to Special processing technology field. Background technique [0002] Under the action of external force, the metal is forced to pass through the mold, the metal cross-section is compressed, and the metal processing method to obtain the required cross-sectional shape and size is called wire drawing. The tool that changes the shape and size of the metal is called a wire drawing die. In order to keep the shape and size of each section of the wire from the initial stage to the final stage, the material of the wire drawing die needs to have sufficient hardness and wear resistance. Commonly used drawing dies include d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/04
Inventor 黄建宇曹凤国
Owner 北京迪蒙吉意超硬材料技术有限公司
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