Electronic component, protection method and apparatus for circuit board

A technology for electronic components and electronic devices, which can be applied in the direction of sealing shell, cooling/ventilation/heating transformation, etc., can solve the problems of poor heat dissipation, short-circuit failure, and high temperature of components, and achieve weight reduction, high reliability, and improved insulation. Effect

Inactive Publication Date: 2009-08-12
梁威
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, since the air flows between the components, the tiny dust suspended in the air cannot avoid partly adhering to these electronic components. The long-term accumulation of these dusts will gradually thicken, causing poor heat dissipation of each component and further causing excessive temperature. If it

Method used

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  • Electronic component, protection method and apparatus for circuit board
  • Electronic component, protection method and apparatus for circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0018] Example 1

[0019] Such as figure 1 As shown, the circuit board 5 or the electronic component 4 of the protection device for electronic components and circuit boards of the present invention is fixed in a closed container 1, and the relevant leads of the electronic components and the circuit board pass through the seal or connector 3 Connect to the outside of container 1. The container is filled with insulating liquid 6 that has no effect on electronic devices and is not corrosive. The insulating liquid 6 is transformer oil. It cannot completely fill the container 1. A certain space 7 is appropriately left to prevent the temperature from rising. The expansion of the liquid will destroy the closed container; the shell of the container 1 is provided with radiating fins 2, which makes the heat dissipation effect better. The circuit board can be fixed in an airtight container, or the circuit board and the airtight container can be integrated. For example, when the airtight con...

Example Embodiment

[0020] Example 2

[0021] Such as figure 2 As shown, another implementation structure of the protection device for electronic components and circuit boards of the present invention is to encapsulate the electronic components and the circuit board together with a smaller radiator 8 filled with polybutene oil + transformer oil + caster. The airtight container 1 of the mixed insulating liquid of sesame oil solves the long-term installation of electronic components that require heat dissipation but are inconvenient to maintain. The rest of the structure is the same as the first embodiment.

[0022] The protective device for the electronic components and circuit boards of the present invention has been used in the computer case tested by the inventor for two years. There is no need to clean the dust regularly, and no electronic components and circuit boards are malfunctioning.

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PUM

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Abstract

The invention provides a method and a device for cooling, dustproofing and waterproofing for electronic devices and components and a circuit board. The electronic devices and components and the circuit board are fixed in a sealed container; insulative non-corrosive liquid without influence on the electronic devices is filled in the container; and related lead wires of the electronic devices and components and the circuit board are connected outside the container through a sealing element or a connector. The method and the device solve the problem that the electronic components and the circuit board are polluted and influenced by dust, vapor or impurities, greatly improve the insulativity, and also greatly improve the reliability of the electronic components and the circuit board.

Description

technical field [0001] The invention relates to a protective device for electronic devices, in particular to a method and device for cooling electronic components and circuit boards, and for preventing dust and water. Background technique [0002] In the electronic circuit device, there are various components that emit heat during normal operation. The traditional way of dissipating this heat is to dissipate it by relying on natural flow or forced flow of air medium to ensure that the temperature is within a certain range. within the acceptable range. These components must also be kept insulated from each other to avoid short circuit failures. In this way, since the air flows between the components, the tiny dust suspended in the air cannot avoid partly adhering to these electronic components. The long-term accumulation of these dusts will gradually thicken, causing poor heat dissipation of each component and further causing excessive temperature. If it is serious, it will...

Claims

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Application Information

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IPC IPC(8): H05K5/06H05K7/20
Inventor 梁威
Owner 梁威
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