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Heat conduction adhesive sheet and preparation method thereof, electronic element and household appliance

A technology of thermally conductive adhesive and thermally conductive adhesive layer, which is applied in the direction of adhesives, epoxy resin adhesives, polymer adhesive additives, etc., can solve the problems that high adhesion cannot be guaranteed, and thermally conductive adhesive products have not yet appeared, so as to improve the heat dissipation effect , improve insulation, and the effect of being friendly to the environment

Active Publication Date: 2016-06-29
珠海格力绿色再生资源有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional thermal adhesives used in frequency converters often cannot guarantee high adhesion under the condition of high insulation and high thermal conductivity, and can only dissipate heat from low-end electronic components.
[0004] Therefore, in the current domestic thermal adhesive industry, there is no high-quality thermal adhesive product suitable for inverters.

Method used

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  • Heat conduction adhesive sheet and preparation method thereof, electronic element and household appliance
  • Heat conduction adhesive sheet and preparation method thereof, electronic element and household appliance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] It is used to illustrate the thermal conductive adhesive composition, thermal conductive film and preparation method thereof of the present invention.

[0063] (1) The first thermal conductive adhesive composition: epoxy resin NPEL-127100 parts, cationic curing agent TC-363210 parts, toughening resin J125667 parts, thermal powder TP-33800 parts, silane coupling agent A1715 parts, butanone 60 parts , Defoamer D103;

[0064] (2) Second thermal conductive adhesive composition: epoxy resin NPEL-127100 parts, cationic curing agent TC-36327 parts, toughening resin J125653 parts, thermal powder TP-33520 parts, silane coupling agent A1717 parts, butanone 60 parts , Defoamer D102;

[0065] (3) Preparation method of thermal conductive film:

[0066] The raw materials in the first thermally conductive adhesive composition were mixed in proportion for 30 minutes (the stirring speed was 1000 r / min), coated on the release film, and dried (80° C.) to obtain the first adhesive film b...

Embodiment 2-5

[0070] It is used to illustrate the thermal conductive adhesive composition, thermal conductive film and preparation method thereof of the present invention.

[0071] (1) The first thermally conductive adhesive composition: with reference to Example 1, the difference lies in the following table:

[0072]

[0073] (2) Second thermally conductive adhesive composition: with reference to Example 1, the difference is: the consumption of cationic curing agent, toughening resin, thermally conductive powder, silane coupling agent and butanone is shown in the following table:

[0074]

[0075] (3) Preparation method of thermally conductive film: the same as in Example 1, the prepared thermally conductive film is S2 to S6.

Embodiment 7

[0077] It is used to illustrate the thermal conductive adhesive composition, thermal conductive film and preparation method thereof of the present invention.

[0078] (1) The first thermally conductive adhesive composition: the same as in Example 1;

[0079] (2) The second thermally conductive adhesive composition: the same as in Example 1;

[0080] (3) Preparation method of thermal conductive film:

[0081] The raw materials in the first thermally conductive adhesive composition were mixed in proportion for 30 minutes (the stirring speed was 1000 r / min), coated on the release film, and dried (80° C.) to obtain the first adhesive film blank. A plastic film body is thermally bonded (temperature 90°C, pressure 3kg, time 40s) to a copper plate, and is cured (100°C, 1h) to form a first thermally conductive adhesive layer (thickness 80μm, curing rate 100%);

[0082] The raw materials in the second thermally conductive adhesive composition are mixed in proportion for 30 minutes (t...

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Abstract

The invention discloses a heat conduction adhesive sheet and a preparation method thereof, an electronic element and a household appliance. The heat conduction adhesive sheet comprises a first heat conduction adhesive layer and a second heat conduction adhesive layer which are composited together. The curing rate of the first heat conduction adhesive layer ranges from 60% to 100%, and the curing rate of the second heat conduction adhesive layer ranges from 30% to 80%. A heat conduction adhesive composition for preparing the heat conduction adhesive sheet comprises epoxy resin, and with 100 parts by weight of epoxy resin as a criterion, the heat conduction adhesive composition further comprises 5-15 parts by weight of cation curing agent, 40-70 parts by weight of toughening resin, 500-800 parts by weight of heat conduction powder, 2-10 parts by weight of silane coupling agent, 30-80 parts by weight of butanone and 1-5 parts by weight of antifoaming agent. According to the heat conduction adhesive sheet formed by compositing the two heat conduction adhesive layers with different curing rates, high insulativity of the heat conduction adhesive sheet can be maintained, and meanwhile the heat conduction adhesive sheet has high heat conductivity and high bonding capacity.

Description

technical field [0001] The invention relates to the field of manufacture of heat-dissipating components, in particular to a heat-conducting film and a preparation method thereof, as well as electronic components and household appliances. Background technique [0002] With the continuous upgrading of the air-conditioning industry in recent years, the performance requirements are getting higher and higher, the configuration is also getting higher and higher, and the heat dissipation requirements are also very high; in the heat dissipation of the inverter, due to the epoxy resin The thermal conductivity is poor, so it is necessary to add thermal conductive fillers with thermal conductivity and insulation effects, and the filling amount should not be too large, otherwise its high adhesion will be greatly affected. [0003] The traditional thermal adhesives used in frequency converters often cannot guarantee high adhesion under the condition of ensuring high insulation and high t...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J163/00C09J11/04C09J11/06C09J11/08C08G59/50C08G59/40
CPCC08G59/4007C08G59/5093C08L2205/025C08L2205/03C09J7/00C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08K2003/2227C08K5/5425
Inventor 吴钦文王红霞王九飙刘劲业周文斌黄家榆
Owner 珠海格力绿色再生资源有限公司
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