Novel plate crimped dual-chip encapsulated ceramic package
A flat crimping, ceramic shell technology, applied in electrical components, electrical solid devices, circuits, etc., to achieve the effect of increasing the heat dissipation area, high insulation, and improving the ability to resist thermal fatigue
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[0024] see figure 1 , The present invention relates to a novel flat plate crimping type double chip package ceramic shell, which is composed of three parts: a ceramic base, a transition electrode 7 and an upper cover;
[0025] see Figures 1 to 2 , the ceramic base is mainly composed of anode flange 1, ceramic ring 2, anode sealing ring 3, anode electrode 4, gate lead tube one 5-1, gate lead tube two 5-2, cathode lead tube 6-1, It consists of cathode inserts 6-2, the inner edge of the anode sealing ring 3 is concentrically welded to the outer edge of the anode electrode 4, the outer edge is concentrically welded to the lower end face of the ceramic ring 2, and the anode flange 1 is concentrically welded to the upper end face of the ceramic ring 2, Anode flange 1, ceramic ring 2 and anode sealing ring 3 are stacked and welded concentrically from top to bottom, and gate lead tube 1 5-1 and gate lead tube 2 5-2 are horizontally connected to the center of the shell wall of cerami...
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