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Agglutinating member and agglutinating method

A technology for bonding components and components, used in bonding methods, connecting components, adhesives, etc., can solve problems such as product yield decline, bonding accuracy and progress impact, and impact on product quality, so as to avoid impact and reduce spillage. The probability of glue occurrence and the effect of improving accuracy

Inactive Publication Date: 2009-09-09
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the two components 1 and 5 are bonded after gluing, when the two components 1 and 5 need to be bonded in place at one time, if the two joint surfaces 3 and 7 are misaligned when they are bonded, it is necessary to clear the glue on the joint surfaces 3 and 7 After that, reapply the glue solution for secondary bonding, and the accuracy and progress of bonding will be easily affected
In addition, when the glue is poorly controlled and excessively applied, the excess glue may overflow around the joint, affecting the quality of the product
After glue overflow occurs, the product needs to be cleared, which will affect the manufacturing progress of the product and cause a decrease in product output

Method used

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  • Agglutinating member and agglutinating method
  • Agglutinating member and agglutinating method
  • Agglutinating member and agglutinating method

Examples

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Embodiment Construction

[0019] The bonding member and bonding method provided by the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0020] see figure 2 , The adhesive member provided by Embodiment 1 of the present invention includes a first member 11 , a second member 13 and a glue 14 connecting the first member 11 and the second member 13 . The first member 11 includes a first bonding surface 15 , a dispensing surface 17 and four dispensing channels 19 , and the dispensing channels 19 in this embodiment are cylindrical holes as an example. The second member 13 includes a second joint surface 21 corresponding to the first joint surface 15 .

[0021] The first member 11 and the second member 13 are two cuboids of different sizes, and they are attached to the second joint surface 21 through the first joint surface 15 . The first bonding surface 15 and the glue dispensing surface 17 of the first member 11 are two planes parallel to each ot...

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PUM

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Abstract

An agglutinating member comprises a first member, a second member and glue by which the first member and the second member are connected. The first member comprises a first junction surface, a sizing surface and a sizing channel. The second member comprises a second junction surface which corresponds to the first junction surface. The glue is sized from the sizing channel, flows to the second junction surface of the second member, and enables the two members to be agglutinated by the inner wall of the sizing channel and the second junction surface. Because of the existence of the sizing channel, the surplus micro glue can stay in the sizing channel, thereby the probability of glue overflow is reduced, and the precision of the agglutination of the members is enhanced. The invention also provides an agglutinating method.

Description

technical field [0001] The present invention relates to an adhesive member and an adhesive method. Background technique [0002] Usually, two components can be connected by welding, riveting, cold crimping, bonding, etc. When the size of the components is small, the tensile strength after the components are connected is not required, or the appearance of the components after the connection is high, the bonding method is often used to bond the components. [0003] see figure 1 , There is a joint surface 3 on the component 1, and a joint surface 7 on the component 5, and the components 1 and 5 are pasted by applying glue on the joint surface 3 or the joint surface 7. Because the two components 1 and 5 are bonded after gluing, when the two components 1 and 5 need to be bonded in place at one time, if the two joint surfaces 3 and 7 are misaligned when they are bonded, it is necessary to clear the glue on the joint surfaces 3 and 7 After that, glue is reapplied for secondary b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16S1/10F16B11/00
CPCC09J5/00Y10T156/10Y10T428/249994
Inventor 郑海权黄建明
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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