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Pin bonding structure

A bonding structure and pin technology, which is applied in the directions of optics, instruments, electrical components, etc., can solve problems affecting the yield rate, misalignment at both ends of the X direction, and reduction of overlapping area, so as to improve the yield rate, ensure circuit connection performance, The effect of a large overlapping area

Inactive Publication Date: 2009-09-09
BEIJING BOE OPTOELECTRONCIS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The defect of the prior art is: due to the influence of factors such as equipment precision or the material precision of the pin itself, misalignment (misalign) often occurs between the driver IC pin and the panel pin, and product failure will occur when the misalignment exceeds a certain specification
Therefore, after the circuit connection of the pins between the existing driver IC and the panel, misalignment of both ends of the X direction due to ductility often occurs.
When the X-direction misalignment is too large, due to the reduction of the overlapping area, the circuit connection performance between the driver IC and the panel is deteriorated, and it is also easy to short-circuit between the pins of adjacent driver ICs, which easily leads to product failure. , affecting the yield

Method used

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Examples

Experimental program
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Embodiment 1

[0021] This embodiment provides a pin bonding structure such as image 3 shown, including panel pins and driver IC pins. Wherein, the panel pin includes a first pad portion 11 and a first lead portion 12 ; the driver IC pin includes a second pad portion 21 and a second lead portion 22 . Wherein, the part shown in the right slash shade represents the panel pin, the left slash shading part represents the drive IC pin, and the grid line shading represents the overlapping part of the panel pin and the drive IC pin.

[0022] The first pad portion 11 of the panel pin matches the size and shape of the second pad portion 21 of the drive IC pin; the first pad portion 11 and the second pad portion 21 corresponding to the position bonded together to form pad pairs. The pads are divided into upper and lower rows, and the lower edge of the upper row of pad pairs is higher than the upper edge of the lower row of pad pairs. Specifically, one of the two adjacent pad pairs is located in the...

Embodiment 2

[0030] On the basis of Embodiment 1, this embodiment provides various lead bonding structures by changing the relative positional relationship between the lead part and the pad part.

[0031] in such as Figure 5A In the structure shown, one of the two adjacent pad pairs is located in the upper left row, and the other is located in the lower right row. Among them, in the center of the pads in the upper left row, the first lead part 121 of the panel pin is located on the left side of the first pad part 111; the second lead part 221 of the drive IC pin is located in the second pad part 211 on the left side. Located in the pad pair in the lower right row, the first lead part 122 of the panel pin is located on the right side of the first pad part 112; the second lead part 222 of the drive IC pin is located at the side of the second pad part 212 middle part.

[0032] in such as Figure 5B In the structure shown, one of the two adjacent pad pairs is located in the lower left row...

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Abstract

The invention relates to a pin bonding structure, which comprises a panel pin and a driver IC pin; a first bonding pad part of the panel pin is matched with the size and shape of a second bonding pad part of the driver IC pin; the first bonding pad part of the panel pin and the second bonding pad part of the driver IC pin corresponding to each other are bonded together to form a bonding pad pair; the bonding pad pair is divided into an upper row and a lower row; and the lower edge of the bonding pad pair in the upper row is higher than the upper edge of the bonding pad pair in the lower row. The pin bonding structure can set the width of each bonding pad wider under the condition of not changing the width of a whole panel, so that the overlapped area of the bonding pads of the panel pin and the driver IC pin is larger; and even if the bonding pads are misplaced due to extension by heating, the circuit connecting performance of the pin bonding structure can be still ensured so as to contribute to improving the yield.

Description

technical field [0001] The invention relates to a pin bonding structure, which belongs to the field of circuit design. Background technique [0002] In the existing Outer Lead Bonding (OLB) process of a liquid crystal display (hereinafter referred to as: LCD), it is necessary to bond a driver integrated circuit (hereinafter referred to as: driver IC) with a panel of the LCD. circuit connection. Specifically, the lead structure of the driver IC and the lead structure of the panel are as follows: Figure 1A , 1B shown. When making circuit connections, the circuit can only be turned on when there is sufficient overlapping area between the two pins. Such as Figure 2A As shown, it is a schematic diagram of the structure when the pins of the driver IC and the pins of the panel are completely coincident and aligned. Wherein, the part shown in the right slash shade represents the panel pin, the left slash shading part represents the drive IC pin, and the grid line shading repr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13H01L21/60
CPCH01L2224/05554
Inventor 宋行宾
Owner BEIJING BOE OPTOELECTRONCIS TECH CO LTD
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